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TS507CDT

STMicroelectronics

TS507CDT by STMicroelectronics

TS507CDT by STMicroelectronics is a low-offset operational amplifier with a max input offset voltage of 550 µV and a common mode reject ratio of 115 dB. It operates at supply voltages of 3/5 V, making it ideal for precision applications. Its compact design and surface mount capability enhance versatility in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,860 parts In-Stock

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2,860

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Digiode

USA . 2,840 parts In-Stock

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2,840

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Anansix

USA . 633 parts In-Stock

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633

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Bristol Electronics

USA . 474 parts In-Stock

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474

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Dan-Mar Components

USA . 474 parts In-Stock

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474

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Distributors (Availability)

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Vigor

Singapore . 7,485 parts In-Stock

1+ parts

$0.670

100+ parts

-

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7,485

$0.670

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Microchip USA

USA . 364 parts In-Stock

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$1.460

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364

$1.460

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IDEA Electronic Components Group

UK . 1,975 parts In-Stock

1+ parts

$6.120

100+ parts

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$5.508

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1,975

$6.120

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$5.508

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MKK Technologies

India . 1,944 parts In-Stock

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$11.508

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1,944

$11.508

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DigiPath Technology Company

USA . 1,944 parts In-Stock

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$11.508

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1,944

$11.508

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AZTECH Wire

Italy . 346 parts In-Stock

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$18.380

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346

$18.380

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Perfect Parts

USA . 13,067 parts In-Stock

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13,067

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A-Z Elektronik GmbH

Germany . 7,236 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Corphita

USA . 2,535 parts In-Stock

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2,535

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Parana Technologies

USA . 1,530 parts In-Stock

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$7.317

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1,530

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$7.317

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Overview

Elevate your designs with the TS507CDT from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality operational amplifier delivers remarkable low offset and bias current, making it ideal for precision applications in audio, industrial control, and sensor interfacing. With a compact surface-mount design and exceptional thermal performance, the TS507CDT ensures reliability and efficiency, providing unbeatable value to engineers and designers seeking top-tier performance in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring reliability in various applications.

Maximum Input Offset Voltage: 550 uV

A low input offset voltage enhances accuracy and precision in signal amplification, making this op amp suitable for high-performance applications.

Maximum Average Bias Current (IIB): 0.075 uA

The ultra-low bias current minimizes errors in signal processing, contributing to improved overall performance in sensitive circuits.

Surface Mount: YES

Surface mount design facilitates easier and more compact PCB layouts, essential for modern electronic device design.

Package Shape: RECTANGULAR

The rectangular package shape is standard for efficient board space utilization, promoting versatile integration with other components.

Nominal Common Mode Reject Ratio: 115 dB

A high common mode rejection ratio ensures better performance in noisy environments, making it ideal for precision analog applications.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5V is standard, providing compatibility with a wide range of power sources.

Power Supplies: 3/5

Flexibility in power supply options allows this op amp to be suitable for various applications requiring different voltage levels.

No. of Terminals: 8

An 8-terminal configuration supports versatile connections, fitting well into complex circuits with various signal paths.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for space-saving, enabling the use of this op amp in compact electronic designs.

Maximum Supply Voltage Limit: 6 V

The supply voltage limit allows for a broad range of applications while ensuring safe operation under specified conditions.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85 °C allows for usage in moderately high-temperature environments, expanding application possibilities.

Maximum Bias Current (IIB) @ 25 °C: 0.075 uA

Consistently low bias current at 25 °C ensures precision in low-power applications, further enhancing device reliability.

Frequency Compensation: YES

Built-in frequency compensation simplifies design complexities, ensuring stable operation across a wide frequency range.

Minimum Operating Temperature: 0 °C

The minimum operating temperature allows this device to function in colder environments, suitable for diverse operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

A high-quality terminal finish ensures excellent solderability and corrosion resistance, enhancing the longevity of electronic connections.

Terminal Position: DUAL

Dual terminal positioning improves circuit integration flexibility, permitting various layouts and configurations.

Low-Offset: YES

Low-offset voltage contributes to high accuracy in applications, making it suitable for data acquisition and precision instrumentation.

Maximum Seated Height: 1.75 mm

A compact seated height allows for tight spacing in designs, essential for modern electronic manufacturing.

Width: 3.9 mm

The compact width enables easy placement on PCBs while saving space for other components.

Maximum Time At Peak Reflow Temperature (s): 40

A relatively long time at peak reflow temperature aids in achieving a good solder joint, critical for manufacturing yield.

Peak Reflow Temperature (°C): 260

A higher peak reflow temperature accommodates advanced soldering processes, suitable for modern manufacturing techniques.

Length: 4.9 mm

Short length facilitates more compact designs, suitable for small form factor electronics.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grades allow for diverse applications, ensuring the device operates reliably in various environments.

Maximum Negative Supply Voltage Limit: 0 V

A zero negative supply voltage limit simplifies configuration, making it easier to integrate into single-supply systems.

Nominal Unity Gain Bandwidth: 1900 kHz

A high unity gain bandwidth ensures fast response times, making this op amp suitable for high-speed applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and ease of assembly, important factors in production efficiency.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this device offers versatility for signal amplification, filtering, and mathematical operations in analog applications.

Maximum Supply Current: 1.25 mA

Low supply current ensures energy efficiency, making it suitable for battery-operated devices.

Nominal Negative Supply Voltage (Vsup): 0 V

A nominal value of 0 V for the negative supply enhances convenience for low-voltage applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides stability and versatility for a variety of applications, from simple amplifiers to complex circuits.

Packing Method: TAPE AND REEL

Tape and reel packaging supports automated assembly processes, improving manufacturing efficiency and reducing labor costs.

Nominal Slow Rate: 0.6 V/us

A nominal slow rate helps in applications requiring controlled response times, ensuring stability in circuit performance.

Terminal Pitch: 1.27 mm

The standard terminal pitch ensures compatibility with existing circuitry and ease of integration during assembly.

Technical Specifications

Operational Amplifiers (Op Amps) TS507CDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

115 dB

Input Offset Voltage Limit:

550 uV

Nominal Slew Rate:

0.6 V/us

Peak Bias Current:

75 nA

Maximum Bias Current (IIB) @25 °C:

75 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

1.25 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS507CDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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