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TS507IQT

STMicroelectronics

TS507IQT by STMicroelectronics

TS507IQT by STMicroelectronics is a low-offset operational amplifier ideal for automotive applications. It features a max input offset voltage of 350 µV, a common mode reject ratio of 125 dB, and operates within -40 °C to 125 °C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,425 parts In-Stock

1+ parts

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4,425

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Vyrian

USA . 2,826 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,826

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Anansix

USA . 660 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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660

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$1.148

100+ parts

-

1k+ parts

$1.033

10k+ parts

-

1,092

$1.148

-

$1.033

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MKK Technologies

India . 1,753 parts In-Stock

1+ parts

$2.159

100+ parts

-

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10k+ parts

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1,753

$2.159

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DigiPath Technology Company

USA . 1,753 parts In-Stock

1+ parts

$2.159

100+ parts

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1,753

$2.159

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Corphita

USA . 3,769 parts In-Stock

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3,769

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Parana Technologies

USA . 206 parts In-Stock

1+ parts

-

100+ parts

$1.373

1k+ parts

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10k+ parts

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206

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$1.373

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Overview

Elevate your designs with the TS507IQT from STMicroelectronics, a standout in operational amplifiers known for its exceptional quality and reliability. With ultra-low offset voltage and bias current, this versatile component ensures precision in even the most demanding applications, including automotive systems. Experience superior temperature performance and compact design, bringing you unmatched efficiency and value. Choose the TS507IQT for innovation that drives success!

Feature Benefit Bullets

Maximum Input Offset Voltage: 350 uV

A low input offset voltage ensures high accuracy in amplification, making it suitable for precision applications.

Maximum Average Bias Current (IIB): 0.15 uA

Low bias current minimizes errors in low-power applications, enhancing performance in battery-operated devices.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly, saving space on PCBs.

Package Shape: SQUARE

Square package shape enables efficient PCB layout and optimizes space utilization.

Nominal Common Mode Reject Ratio: 125 dB

A high CMRR ensures better performance in noisy environments by reducing the impact of common-mode signals.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage makes it compatible with a wide range of applications and devices.

Power Supplies (V): 3/5

Dual supply voltage options enhance versatility in various electronic circuits.

No. of Terminals: 8

Having 8 terminals allows for flexibility in circuit design and connections.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design facilitates placement in space-constrained applications without thermal compromise.

Maximum Supply Voltage Limit: 6 V

A maximum supply voltage limit provides a safety margin for reliable operation in diverse applications.

Maximum Operating Temperature: 125 °C

High operational temperature rating makes it suitable for demanding automotive and industrial environments.

Frequency Compensation: YES

Integrated frequency compensation simplifies design and stabilizes performance across various frequencies.

Minimum Operating Temperature: -40 °C

Low temperature capability ensures reliable operation in extreme conditions, ideal for automotive use.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and enhances signal routing options.

Low-Offset: YES

Low-offset characteristics improve signal integrity, making it ideal for precise signal processing applications.

Maximum Seated Height: 1 mm

Compact seated height facilitates integration into thin devices and enhances form factor optimization.

Width: 3 mm

Narrow width allows for efficient use of PCB space in densely packed designs.

Length: 3 mm

Short length contributes to a compact design, making it suitable for miniaturized electronic products.

Temperature Grade: AUTOMOTIVE

Automotive-grade specifications ensure reliability and safety in automotive applications.

Maximum Negative Supply Voltage Limit: 0 V

Restricting negative supply voltage enhances safety and compatibility in various applications.

Nominal Unity Gain Bandwidth: 2200 kHz

High bandwidth supports a wide range of frequencies, suitable for high-speed signal processing.

Terminal Form: NO LEAD

No-lead terminal design improves thermal management and soldering reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier designation indicates versatility for various signal manipulation tasks.

Nominal Negative Supply Voltage (Vsup): 0 V

Zero negative supply voltage simplifies power management and circuit design.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture allows for better linearity and stability, enhancing overall amplifier performance.

Packing Method: TAPE AND REEL

Tape and reel packaging facilitates automated handling and efficient mass production.

Nominal Slew Rate: 0.65 V/µs

Adequate slew rate supports fast signal transitions, making it suitable for high-frequency applications.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for compact assembly and suitability for high-density layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TS507IQT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

125 dB

Input Offset Voltage Limit:

350 uV

Nominal Slew Rate:

0.65 V/us

Peak Bias Current:

150 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Total Terminals:

8

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-XDSO-N8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Equivalence Code:

SOLCC8,.11,20

Trade Compliance

TS507IQT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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