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TS507IST

STMicroelectronics

TS507IST by STMicroelectronics

TS507IST by STMicroelectronics is a low-offset operational amplifier ideal for automotive applications. It features a max input offset voltage of 350 µV, a common mode reject ratio of 125 dB, and operates within -40 °C to 125 °C. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,981 parts In-Stock

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4,981

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Vyrian

USA . 4,955 parts In-Stock

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4,955

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Anansix

USA . 2,513 parts In-Stock

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2,513

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IDEA Electronic Components Group

UK . 1,147 parts In-Stock

1+ parts

$6.025

100+ parts

-

1k+ parts

$5.423

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1,147

$6.025

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$5.423

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MKK Technologies

India . 195 parts In-Stock

1+ parts

$11.330

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195

$11.330

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DigiPath Technology Company

USA . 195 parts In-Stock

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$11.330

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195

$11.330

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Parana Technologies

USA . 1,382 parts In-Stock

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$7.204

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1,382

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$7.204

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Corphita

USA . 1,132 parts In-Stock

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Overview

Elevate your designs with the TS507IST operational amplifier from STMicroelectronics, a leader in innovation and reliability. This compact, low-offset op-amp excels in automotive applications, ensuring peak performance even in extreme conditions. With unmatched precision and minimal bias current, it delivers superior signal integrity, making it ideal for demanding circuits. Trust STMicroelectronics for quality and efficiency that drive your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 350 uV

A low maximum input offset voltage ensures accurate signal amplification, making this op-amp ideal for precision applications.

Maximum Average Bias Current (IIB): 0.15 uA

A very low bias current minimizes error and power consumption, benefiting battery-operated and low-power devices.

Surface Mount: YES

The surface mount design allows for efficient PCB space utilization and supports high-density circuit designs.

Package Shape: SQUARE

The square package shape is effective for thermal management and provides a compact footprint on the PCB.

Nominal Common Mode Reject Ratio: 125 dB

A high common mode rejection ratio improves noise immunity, enhancing performance in noisy environments.

Nominal Supply Voltage / Vsup (V): 5

This nominal supply voltage is compatible with standard logic levels, making integration with various circuits straightforward.

Power Supplies (V): 3/5

The versatility in power supply options (3V or 5V) allows flexibility in design for different applications.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connectivity for various input/output configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this op-amp suitable for space-constrained designs, while the shrink pitch enhances density.

Maximum Supply Voltage Limit: 6 V

A maximum supply voltage limit of 6V ensures safety in higher voltage applications while maintaining optimal operation.

Maximum Operating Temperature: 125 °C

This high maximum operating temperature ensures reliable performance in demanding automotive environments.

Frequency Compensation: YES

Frequency compensation assures stable operation across a range of frequencies, enhancing the reliability of performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures is critical for applications in extreme conditions, particularly in automotive settings.

Terminal Finish: Matte Tin (Sn)

Matte tin terminals provide good solderability and corrosion resistance, improving reliability and longevity.

Terminal Position: DUAL

Dual terminal position increases flexibility in layout design and allows for easier routing on the PCB.

Low-Offset: YES

Low-offset characteristics enhance precision in signal-processing applications, making this op-amp suitable for high-accuracy tasks.

Maximum Seated Height: 1.1 mm

The low seated height contributes to a compact design, making it ideal for thin-profile applications.

Width: 3 mm

Compact dimensions reduce PCB space usage, allowing for more efficient design arrangements.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum reflow duration of 30 seconds ensures reliability during the soldering process, preventing damage to sensitive components.

Peak Reflow Temperature: 260 °C

Support for high reflow temperatures ensures compatibility with lead-free soldering processes in modern manufacturing.

Length: 3 mm

The small length supports various compact designs, further optimizing space on PCBs.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring reliability and performance in harsh environments.

Maximum Negative Supply Voltage Limit: 0 V

This specification allows for operational safety in designs where negative voltages are not required.

Nominal Unity Gain Bandwidth: 2200 kHz

A high nominal unity gain bandwidth allows the op-amp to perform well in high-frequency applications.

Terminal Form: GULL WING

Gull wing leads facilitate easier soldering and provide reliable attachment to the PCB, minimizing mechanical stress.

Amplifier Type: OPERATIONAL AMPLIFIER

This product is categorized as an operational amplifier, which is integral in signal amplification and processing across many applications.

Nominal Negative Supply Voltage (Vsup): 0 V

A nominal negative supply voltage of 0V simplifies power supply requirements in single-supply applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture enhances stability and performance in a wide range of applications.

Packing Method: TAPE AND REEL

Tape and reel packaging improves manufacturing efficiency by facilitating automatic assembly processes.

Nominal Slow Rate: 0.65 V/us

A nominal slow rate improves signal fidelity and reduces distortion, essential for high-performance analog circuits.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch supports high-density designs, improving layout efficiency on modern PCBs.

Technical Specifications

Operational Amplifiers (Op Amps) TS507IST attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.2 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

125 dB

Input Offset Voltage Limit:

350 uV

Nominal Slew Rate:

0.65 V/us

Peak Bias Current:

150 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

TS507IST Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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