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TS420-700T

STMicroelectronics

TS420-700T by STMicroelectronics

The STMicroelectronics TS420-700T is a single SCR with 700V repetitive peak reverse voltage and 30A non-repetitive peak on-state current. It is used in applications requiring high reliability and robust performance, such as industrial power supplies and motor control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,707 parts In-Stock

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2,707

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Digiode

USA . 2,244 parts In-Stock

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2,244

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Anansix

USA . 2,210 parts In-Stock

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2,210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 217 parts In-Stock

1+ parts

$1.952

100+ parts

-

1k+ parts

$1.757

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217

$1.952

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$1.757

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MKK Technologies

India . 1,707 parts In-Stock

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$3.671

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1,707

$3.671

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DigiPath Technology Company

USA . 1,707 parts In-Stock

1+ parts

$3.671

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1,707

$3.671

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$4.746

100+ parts

$4.319

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$3.892

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3,000

$4.746

$4.319

$3.892

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AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$12.760

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847

$12.760

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Component Stockers USA

USA . 645 parts In-Stock

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$99.990

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645

$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Parana Technologies

USA . 1,457 parts In-Stock

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$2.334

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$2.334

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Corphita

USA . 1,105 parts In-Stock

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Overview

Looking for a reliable Silicon Controlled Rectifier (SCR) for your next project? Look no further than the TS420-700T by STMicroelectronics. With a reputation for quality and innovation, STMicroelectronics delivers top-notch products that meet the highest standards. The TS420-700T offers a maximum DC Gate Trigger Current of 0.2 mA and a Repetitive Peak Off-state Voltage of 700 V, making it ideal for a wide range of applications. Trust in STMicroelectronics to provide you with the value, benefits, and advantages you need to succeed. Upgrade to the TS420-700T today and experience the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Maximum DC Gate Trigger Current: 0.2 mA

Allows for precise control of the SCR, making it suitable for a variety of applications.

Configuration: SINGLE

Simplified design and easy integration into circuits.

Non Repetitive Peak On-state Current: 30 A

Capable of handling high current pulses without damage.

Package Shape: RECTANGULAR

Facilitates easy mounting and installation in standard configurations.

Terminal Form: THROUGH-HOLE

Allows for sturdy and secure connections to the circuit board.

Maximum On-state Current: 2.5 A

Can handle moderate current loads efficiently.

Maximum Leakage Current: 1 mA

Ensures low power dissipation in standby mode.

Repetitive Peak Reverse Voltage: 700 V

Provides high voltage tolerance for reliable operation.

No. of Terminals: 3

Simple to connect and integrate into existing circuit designs.

Package Style (Meter): FLANGE MOUNT

Offers flexibility in mounting options for various applications.

Maximum Operating Temperature: 125 °C

Can operate in a wide range of temperatures, suitable for diverse environments.

Trigger Device Type: SCR

Provides high efficiency and reliability in switching applications.

Minimum Operating Temperature: -40 °C

Capable of operating in low-temperature environments without issues.

Terminal Finish: MATTE TIN

Ensures good conductivity and corrosion resistance for long-term performance.

Terminal Position: SINGLE

Facilitates easy installation and connection in the circuit.

Maximum RMS On-state Current: 4 A

Can handle moderate continuous current loads efficiently.

Maximum DC Gate Trigger Voltage: 0.8 V

Low trigger voltage allows for efficient and precise control of the SCR.

Case Connection: ANODE

Clear indication of the terminal connection for easy integration into the circuit.

Repetitive Peak Off-state Voltage: 700 V

Provides high voltage insulation for reliable off-state performance.

Minimum Critical Rate of Rise of Off-state Voltage: 5 V/us

Helps in preventing overvoltage conditions and enhances the safety of the circuit.

Maximum Holding Current: 5 mA

Allows the device to remain in the on-state without needing continuous gate current.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TS420-700T attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

5 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

1 mA

Non Repetitive Peak On-state Current:

30 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

2.5 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

700 V

Repetitive Peak Reverse Voltage:

700 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

TS420-700T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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