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TS420-400T

STMicroelectronics

TS420-400T by STMicroelectronics

The STMicroelectronics TS420-400T is a single SCR with 400V repetitive peak reverse voltage and 4A max RMS on-state current. It has a 0.2mA max DC gate trigger current, making it suitable for applications requiring reliable power control in industrial settings. The package style is flange mount with through-hole terminals, ideal for high-temperature environments up to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,485 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,485

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Vyrian

USA . 2,386 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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2,386

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Anansix

USA . 2,095 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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2,095

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,945 parts In-Stock

1+ parts

$2.264

100+ parts

-

1k+ parts

$2.038

10k+ parts

-

1,945

$2.264

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$2.038

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MKK Technologies

India . 965 parts In-Stock

1+ parts

$4.258

100+ parts

-

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965

$4.258

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DigiPath Technology Company

USA . 965 parts In-Stock

1+ parts

$4.258

100+ parts

-

1k+ parts

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10k+ parts

-

965

$4.258

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-

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Corphita

USA . 2,680 parts In-Stock

1+ parts

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2,680

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Parana Technologies

USA . 1,863 parts In-Stock

1+ parts

-

100+ parts

$2.707

1k+ parts

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10k+ parts

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1,863

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$2.707

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Overview

Enhance your electronic projects with the TS420-400T Silicon Controlled Rectifier by STMicroelectronics. Known for its superior quality and reliability, STMicroelectronics delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this SCR offers customers unmatched value and performance. With a maximum RMS on-state current of 4A and repetitive peak reverse voltage of 400V, the TS420-400T is the perfect choice for your next project. Experience the benefits of STMicroelectronics' expertise and innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection against environmental factors, making the product reliable for long-term use.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current ensures efficient and controlled switching, reducing power consumption and ensuring smooth operation.

Repetitive Peak Reverse Voltage: 400 V

High reverse voltage capability allows the SCR to withstand voltage spikes and overvoltage conditions, enhancing product reliability.

Maximum RMS On-state Current: 4 A

With a high on-state current rating, this SCR can handle heavy loads effectively, making it suitable for various industrial applications.

Configuration: SINGLE

Single configuration simplifies installation and maintenance, making it suitable for applications where space is limited.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide easy and secure connections, enhancing the overall reliability and ease of use of the product.

Maximum Operating Temperature: 125 °C

High operating temperature range allows the SCR to perform reliably in a wide range of environmental conditions.

Trigger Device Type: SCR

Being an SCR, this product provides precise control over switching applications, ensuring efficient and reliable operation.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating enhances the SCR's ability to block voltage, making it suitable for applications with high voltage requirements.

Technical Specifications

Silicon Controlled Rectifiers (SCR) TS420-400T attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

.2 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

400 V

Repetitive Peak Reverse Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

TS420-400T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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