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TDE1897RFP

STMicroelectronics

TDE1897RFP by STMicroelectronics

TDE1897RFP by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 35V, supporting up to 0.625A output current. It features built-in protections against overcurrent and thermal issues, making it ideal for robust applications. Its compact SO package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,105 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,105

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Chip Stock

USA . 7,500 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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7,500

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-

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Digiode

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

1,802

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Anansix

USA . 1,171 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,171

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 800 parts In-Stock

1+ parts

$8.815

100+ parts

-

1k+ parts

$7.933

10k+ parts

-

800

$8.815

-

$7.933

-

AZTECH Wire

Italy . 1,146 parts In-Stock

1+ parts

$13.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1,146

$13.640

-

-

-

MKK Technologies

India . 1,176 parts In-Stock

1+ parts

$16.575

100+ parts

-

1k+ parts

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10k+ parts

-

1,176

$16.575

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-

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DigiPath Technology Company

USA . 1,176 parts In-Stock

1+ parts

$16.575

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$16.575

-

-

-

Microchip USA

USA . 257 parts In-Stock

1+ parts

$24.881

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$24.881

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-

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Component Stockers USA

USA . 449 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

449

$99.990

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-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,500

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-

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A-Z Elektronik GmbH

Germany . 2,841 parts In-Stock

1+ parts

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100+ parts

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2,841

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Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

-

100+ parts

$10.539

1k+ parts

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1,612

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$10.539

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RC Electronics

USA . 800 parts In-Stock

1+ parts

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100+ parts

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800

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Corphita

USA . 85 parts In-Stock

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85

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Assy Fe

Spain . 26 parts In-Stock

1+ parts

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26

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Overview

Elevate your designs with the TDE1897RFP from STMicroelectronics—your go-to peripheral driver for unmatched reliability and performance. Crafted with precision, this high-quality device offers built-in protections against overcurrent and thermal events, ensuring longevity and peace of mind in various applications. With a compact design and robust operating range, it seamlessly meets the needs of modern electronics, delivering exceptional value and efficiency for every project. Choose STMicroelectronics for innovation you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern electronic devices, maximizing circuit efficiency.

Maximum Supply Voltage: 35 V

With a maximum supply voltage of 35 V, this driver can handle a wide range of power supply applications, providing versatility.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, allowing for better layout and design.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

These built-in protection features enhance reliability and safety, safeguarding the device against common electrical issues.

Power Supplies (V): 18/35

This flexible supply voltage range allows the driver to be compatible with various power source configurations.

No. of Terminals: 20

A higher number of terminals provides extensive connectivity options, allowing for multiple functional integrations.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact form factor, which is ideal for space-constrained electronic designs.

Minimum Supply Voltage-1: 9 V

The ability to operate at a minimum supply voltage of 9 V enhances compatibility with lower voltage applications.

Minimum Supply Voltage: 18 V

Operating minimum voltage at 18 V allows for effective performance in standard applications requiring a baseline supply.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates suitability for conditions that require robustness in thermal environments.

Minimum Operating Temperature: -25 °C

This product functions well in low-temperature environments, making it versatile for outdoor and cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish improves conductivity and reduces corrosion, enhancing long-term performance.

Terminal Position: DUAL

Dual terminal positioning aids in easy PCB layout and design, providing flexibility in circuit design.

Maximum Seated Height: 2.65 mm

A low profile seated height enhances space efficiency on the PCB, aiding in the overall compactness of the design.

Width: 7.5 mm

With a width of 7.5 mm, this driver fits well into designs where space-saving is crucial.

Length: 12.8 mm

The compact length enables tight packing of components, facilitating more complex circuit designs.

Temperature Grade: COMMERCIAL EXTENDED

Rated for commercial extended temperature ranges, this driver is suited for a variety of standard electronic applications.

Maximum Output Current: 0.625 A

An output current of 0.625 A provides sufficient power for medium load applications, delivering reliable performance.

Technology: BCDMOS

The BCDMOS technology offers high efficiency and performance in driving applications, perfect for contemporary electronic needs.

Terminal Form: GULL WING

The gull wing terminal form allows for robust soldering connections, enhancing the mechanical reliability of the device.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24 V is ideal for many applications, providing a stable and predictable operating condition.

Turn-on Time: 100 us

A quick turn-on time facilitates faster response in dynamic applications, enhancing the efficiency of the device.

Terminal Pitch: 1.27 mm

The standard terminal pitch facilitates compatibility with a wide range of PCB designs and layouts.

Nominal Output Peak Current Limit: 0.75 A

A peak current limit of 0.75 A ensures that the driver can handle occasional higher loads without damaging itself.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface IC type supports a wide array of applications, providing flexibility for peripheral driving needs.

Turn-off Time: 20 us

A rapid turn-off time enhances performance in switching applications, allowing for quick signal transitions.

Output Current Flow Direction: SINK

The sink current flow direction is ideal for interfacing with logic circuits, providing a straightforward connectivity solution.

Technical Specifications

Peripheral Drivers TDE1897RFP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

.625 A

Nominal Output Peak Current Limit:

.75 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

18/35

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

18 V

Nominal Supply Voltage:

24 V

Maximum Supply Voltage-1:

35 V

Minimum Supply Voltage-1:

9 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

20 us

Turn-on Time:

100 us

Width:

7.5 mm

Trade Compliance

TDE1897RFP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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