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TDE1787DP

STMicroelectronics

TDE1787DP by STMicroelectronics

TDE1787DP by STMicroelectronics is a peripheral driver with a max supply voltage of 45V and built-in protections for over current and thermal issues. It operates b/w -25 to 85 °C, has a max output current of 0.3A, and is ideal for applications requiring buffer or inverter based peripheral drivers.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,527 parts In-Stock

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5,527

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Digiode

USA . 3,444 parts In-Stock

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3,444

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Anansix

USA . 2,809 parts In-Stock

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2,809

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ECAB

Sweden . 1,905 parts In-Stock

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ComSIT Distribution GmbH

Germany . 476 parts In-Stock

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476

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J2 Sourcing AB

Sweden . 65 parts In-Stock

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Prism Electronics

USA . 48 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 393 parts In-Stock

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$6.582

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393

$6.582

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IDEA Electronic Components Group

UK . 581 parts In-Stock

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$12.152

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$10.937

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581

$12.152

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$10.937

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AZTECH Wire

Italy . 1,181 parts In-Stock

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$15.640

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$15.640

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MKK Technologies

India . 776 parts In-Stock

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$22.852

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DigiPath Technology Company

USA . 776 parts In-Stock

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$22.852

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Kepictronics

USA . 3,745 parts In-Stock

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RC Electronics

USA . 2,921 parts In-Stock

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Parana Technologies

USA . 1,742 parts In-Stock

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$14.530

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Corphita

USA . 846 parts In-Stock

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Assy Fe

Spain . 508 parts In-Stock

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Perfect Parts

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Overview

Discover the TDE1787DP by STMicroelectronics, a top-quality peripheral driver designed to enhance your electronic projects. With built-in protections against overcurrent and thermal issues, this product offers peace of mind and reliability. Whether you're working on industrial automation, home appliances, or automotive systems, this versatile component delivers superior performance. Trust in STMicroelectronics' reputation for excellence and unlock the full potential of your next innovation with the TDE1787DP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Maximum Supply Voltage: 45 V

Ability to handle a maximum supply voltage of 45V makes it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into different circuit designs.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections against over current and thermal issues enhance safety and prevent damage to the device.

Power Supplies (V): 6/60

Support for power supplies ranging from 6V to 60V offers flexibility in usage.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for various connection configurations.

Package Style (Meter): IN-LINE

In-line package style makes it easy to incorporate the peripheral driver into existing setups.

Minimum Supply Voltage: 6 V

The minimum supply voltage of 6V ensures compatibility with lower voltage systems.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows for reliable performance in various environments.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature of -25 °C enables the driver to function in cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal position enhances stability and connectivity of the device.

Maximum Seated Height: 5.08 mm

Low maximum seated height allows for compact and space-saving designs.

Width: 7.62 mm

Compact width of 7.62mm enables easy integration into circuits with limited space.

Maximum Output Current: 0.3 A

High maximum output current of 0.3A provides ample power for driving peripherals.

Technology: BIPOLAR

Bipolar technology offers high-performance characteristics suitable for demanding applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form facilitates easy and secure mounting onto PCBs.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm enables compatibility with common connectors.

Nominal Output Peak Current Limit: 0.38 A

The nominal output peak current limit of 0.38A ensures stable operation under peak load conditions.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type provides versatility in communication protocols and signal processing.

Output Current Flow Direction: SOURCE

Source flow direction simplifies the design and connection of external peripherals.

Technical Specifications

Peripheral Drivers TDE1787DP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.3 A

Nominal Output Peak Current Limit:

.38 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

6/60

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

45 V

Minimum Supply Voltage:

6 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDE1787DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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