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TDA7528

STMicroelectronics

TDA7528 by STMicroelectronics

TDA7528 by STMicroelectronics is a 64-terminal consumer circuit IC with a package style of flatpack, heat sink/slug, low profile, and fine pitch. It operates in automotive temperature grades from -40 to 125 °C and has a min supply voltage of 4.7V. This IC is suitable for various applications requiring high performance in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,390

-

-

-

-

Digiode

USA . 4,861 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,861

-

-

-

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Anansix

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 601 parts In-Stock

1+ parts

$1.791

100+ parts

-

1k+ parts

$1.612

10k+ parts

-

601

$1.791

-

$1.612

-

MKK Technologies

India . 1,087 parts In-Stock

1+ parts

$3.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

$3.368

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-

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DigiPath Technology Company

USA . 1,087 parts In-Stock

1+ parts

$3.368

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

$3.368

-

-

-

AZTECH Wire

Italy . 974 parts In-Stock

1+ parts

$17.840

100+ parts

-

1k+ parts

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10k+ parts

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974

$17.840

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-

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Parana Technologies

USA . 1,531 parts In-Stock

1+ parts

-

100+ parts

$2.142

1k+ parts

-

10k+ parts

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1,531

-

$2.142

-

-

Corphita

USA . 824 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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824

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Overview

Experience high-quality audio performance with the TDA7528 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures reliability and innovation in their products. The TDA7528 falls under the category of Other Function Consumer ICs, making it versatile for various applications. With its compact design and advanced features, this product offers customers exceptional value and benefits. Enhance your sound systems with the TDA7528 and enjoy superior audio quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability to the product and helps in protecting the internal components.

Surface Mount: YES

Surface mount feature allows for easy installation on PCBs, saving space and making assembly efficient.

Package Shape: SQUARE

Square package shape ensures uniformity in design and helps in easy placement on the circuit board.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer circuits, making it suitable for various consumer electronic applications.

No. of Terminals: 64

With 64 terminals, this product allows for multiple connections and functionalities within the circuit.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the product can withstand rigorous usage environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position provides stability and reliability for the connections within the circuit.

Width: 10 mm

Compact width of 10 mm allows for easy integration into various electronic devices or systems.

Minimum Supply Voltage (Vsup): 4.7 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and secure connection during assembly.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance in vehicle electronic systems.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product is suitable for reflow soldering with a peak temperature of 260 °C.

Maximum Supply Voltage (Vsup): 5.35 V

High maximum supply voltage allows for flexibility in power input options for the product.

Technical Specifications

Other Function Consumer ICs TDA7528 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.35 V

Minimum Supply Voltage (Vsup):

4.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TDA7528 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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