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TDA7500A

STMicroelectronics

TDA7500A by STMicroelectronics

TDA7500A by STMicroelectronics is a low-profile automotive IC with a 3.3V supply, operating b/w -40 °C to 125°C. It features 100 terminals in a gull-wing configuration and supports CMOS technology. Ideal for consumer applications requiring robust performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,557 parts In-Stock

1+ parts

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8,557

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Digiode

USA . 2,486 parts In-Stock

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2,486

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Anansix

USA . 1,672 parts In-Stock

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1,672

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Q Components

USA . 74 parts In-Stock

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74

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,632 parts In-Stock

1+ parts

$3.320

100+ parts

-

1k+ parts

$2.988

10k+ parts

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1,632

$3.320

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$2.988

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MKK Technologies

India . 1,008 parts In-Stock

1+ parts

$6.244

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1,008

$6.244

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DigiPath Technology Company

USA . 1,008 parts In-Stock

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$6.244

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1,008

$6.244

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AZTECH Wire

Italy . 990 parts In-Stock

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$9.270

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990

$9.270

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Microchip USA

USA . 177 parts In-Stock

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$19.710

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177

$19.710

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A-Z Elektronik GmbH

Germany . 5,012 parts In-Stock

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5,012

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Corphita

USA . 2,080 parts In-Stock

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2,080

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Parana Technologies

USA . 286 parts In-Stock

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$3.970

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286

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$3.970

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Overview

Unlock superior performance and reliability with the TDA7500A from STMicroelectronics, a leader in cutting-edge consumer ICs. This automotive-grade chip excels in diverse applications, ensuring high-quality sound and seamless connectivity. With its low-profile design and robust temperature range, it guarantees optimal operation in any environment. Trust STMicroelectronics for innovation that enhances your products, driving value and enhancing user experience like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable package, making this IC suitable for a variety of consumer applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space and enables high-density designs, which is ideal for modern electronic applications.

Package Shape: SQUARE

A square package shape provides balanced size dimensions, facilitating easier integration into circuit layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance with a wide range of electronic devices.

Power Supplies: 3.3 V

Standard 3.3 V operation is compatible with many digital circuits, making it easy to incorporate into existing systems.

No. of Terminals: 100

A high terminal count allows for more functionality and connections, making this IC versatile for complex circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile and fine pitch design supports space-efficient layouts, ideal for slim consumer electronics.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures ensures reliability and performance in demanding environments, suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Operating in extreme cold conditions makes this IC reliable for outdoor and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances durability and solderability, improving the longevity and reliability of connections.

Terminal Position: QUAD

Quad terminal positioning aids in efficient routing on PCBs, simplifying design and layout for engineers.

Maximum Seated Height: 1.6 mm

A low seated height allows for compact design solutions, enabling thinner product designs.

Width: 14 mm

Standard width facilitates easy integration into existing form factors for consumer electronics.

Minimum Supply Voltage (Vsup): 3.15 V

Provides flexibility in power supply choices, accommodating a wide range of applications.

Length: 14 mm

A standard length complements its width, creating a square form factor that is convenient for PCB implementation.

Temperature Grade: AUTOMOTIVE

Designed to meet the stringent requirements of automotive applications, ensuring safety and reliability.

Technology: CMOS

CMOS technology provides low power consumption and high speed, making it ideal for energy-efficient consumer designs.

Terminal Form: GULL WING

Gull wing terminals allow for easier handling during assembly and provide excellent wetting for reliable solder joints.

Maximum Supply Current: 490 mA

A maximum supply current of 490 mA supports demanding applications while ensuring stable operation.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for more connections in a smaller area, beneficial for high-density PCB layouts.

Maximum Supply Voltage (Vsup): 3.45 V

Ability to operate at higher power limits enhances performance in demanding applications without compromising reliability.

Technical Specifications

Other Function Consumer ICs TDA7500A attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

490 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TDA7500A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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