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TDA7479AD

STMicroelectronics

TDA7479AD by STMicroelectronics

TDA7479AD by STMicroelectronics is a CMOS consumer IC designed for industrial applications. It operates b/w 4.5V and 5.5V, with a max current of 11mA and temp range from -40 °C to 85 °C. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,785 parts In-Stock

1+ parts

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5,785

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Digiode

USA . 4,518 parts In-Stock

1+ parts

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-

1k+ parts

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4,518

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Anansix

USA . 593 parts In-Stock

1+ parts

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593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$2.451

100+ parts

-

1k+ parts

$2.206

10k+ parts

-

27

$2.451

-

$2.206

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MKK Technologies

India . 1,122 parts In-Stock

1+ parts

$4.609

100+ parts

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1,122

$4.609

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DigiPath Technology Company

USA . 1,122 parts In-Stock

1+ parts

$4.609

100+ parts

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1,122

$4.609

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AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$19.670

100+ parts

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418

$19.670

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A-Z Elektronik GmbH

Germany . 5,505 parts In-Stock

1+ parts

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5,505

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Corphita

USA . 3,346 parts In-Stock

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3,346

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Parana Technologies

USA . 818 parts In-Stock

1+ parts

-

100+ parts

$2.930

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818

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$2.930

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Metaverse IC Inc.

Canada . 460 parts In-Stock

1+ parts

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460

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Overview

Elevate your audio experience with the TDA7479AD from STMicroelectronics—a leader in innovative consumer IC solutions. This compact, high-performance device ensures crystal-clear sound quality and enhanced audio control for a variety of applications, from TVs to portable speakers. With robust reliability across diverse environments, customers benefit from its long-lasting performance and superior build quality, making it the go-to choice for modern audio needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, PLASTIC/EPOXY ensures reliability and versatility in various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space and ease of assembly on PCBs, making it suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized footprint that supports easier integration into existing layouts.

General IC Type: CONSUMER CIRCUIT

Tailored for consumer applications, this IC is optimized for performance in everyday devices.

Power Supplies (V): 5

Operates at a common voltage level, ensuring compatibility with a wide range of consumer electronics.

No. of Terminals: 16

With 16 terminals, the IC offers multiple connection options, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves board space, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for a wide range of thermal environments.

Minimum Operating Temperature: -40 °C

Supports operation in harsh conditions, making it ideal for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and corrosion resistance, enhancing the reliability of connections.

Terminal Position: DUAL

Dual terminal positioning allows for versatile mounting options, increasing flexibility during the PCB design process.

Maximum Seated Height: 1.2 mm

A low profile design ensures compatibility with other components on the board, maintaining a slim overall design.

Width: 4.4 mm

A compact width helps optimize the space utilization on circuit boards without compromising performance.

Minimum Supply Voltage (Vsup): 4.5 V

Ensures efficient operation across a range of power supplies; compatible with typical consumer products.

Maximum Time At Peak Reflow Temperature (s): 40

This specification indicates the IC can withstand typical soldering processes without damage, making it easier to manufacture.

Peak Reflow Temperature °C: 260

Can endure high temperatures during soldering, ensuring reliability and durability of the component post-assembly.

Length: 5 mm

A short length makes it suitable for integration into tight spaces within consumer devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, emphasizing ruggedness and performance under adverse conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a great choice for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier placement and soldering processes, improving manufacturability.

Maximum Supply Current: 11 mA

Low power consumption makes this IC ideal for portable and energy-efficient applications.

Terminal Pitch: 0.65 mm

A moderate terminal pitch allows for easier soldering and mounting while still being compact enough for small devices.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a balance between sensitivity to moisture and safety in handling, suitable for most standard manufacturing processes.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage that aligns well with common consumer electronics, ensuring broad compatibility.

Technical Specifications

Other Function Consumer ICs TDA7479AD attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

TDA7479AD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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