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TDA7407

STMicroelectronics

TDA7407 by STMicroelectronics

TDA7407 from STMicroelectronics is a low-profile consumer IC designed for industrial applications, operating b/w -40 °C and 85°C. It features a compact 10mm x 10mm square package with 44 terminals and supports power supplies of 7.5V to 10V. This BICMOS technology device ensures efficient performance with a max supply current of 40mA.

Median Price

$8.810

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 103 parts In-Stock

1+ parts

$8.810

100+ parts

$5.871

1k+ parts

-

10k+ parts

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103

$8.810

$5.871

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 57 parts In-Stock

1+ parts

$10.478

100+ parts

-

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-

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57

$10.478

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Vyrian

USA . 2,236 parts In-Stock

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2,236

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Anansix

USA . 2,088 parts In-Stock

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2,088

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ComSIT Distribution GmbH

Germany . 960 parts In-Stock

1+ parts

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960

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Cyclops Electronics Ltd

UK . 450 parts In-Stock

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$1.903

100+ parts

-

1k+ parts

$1.713

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-

620

$1.903

-

$1.713

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MKK Technologies

India . 507 parts In-Stock

1+ parts

$3.579

100+ parts

-

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507

$3.579

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DigiPath Technology Company

USA . 507 parts In-Stock

1+ parts

$3.579

100+ parts

-

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507

$3.579

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Corphita

USA . 2,010 parts In-Stock

1+ parts

$9.927

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2,010

$9.927

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QUARKTWIN TECHNOLOGY LTD

USA . 25,554 parts In-Stock

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25,554

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A-Z Elektronik GmbH

Germany . 6,468 parts In-Stock

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6,468

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Metaverse IC Inc.

Canada . 2,800 parts In-Stock

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2,800

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Assy Fe

Spain . 2,800 parts In-Stock

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2,800

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Parana Technologies

USA . 1,118 parts In-Stock

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$2.276

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1,118

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$2.276

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Kepictronics

USA . 858 parts In-Stock

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858

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RC Electronics

USA . 558 parts In-Stock

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558

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Perfect Parts

USA . 106 parts In-Stock

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106

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Overview

Experience unparalleled sound quality with the TDA7407 from STMicroelectronics, a trusted leader in semiconductor innovation. This sleek, low-profile consumer IC is designed to elevate audio performance in various applications, from automotive to home entertainment systems. Engineered for reliability and efficiency, its robust thermal performance ensures a seamless operation even in challenging environments. Unlock your designs' potential with the TDA7407, where superior craftsmanship meets exceptional value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and protection from environmental factors, ensuring long-term reliability of the IC.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of circuit board space, making this IC suitable for modern electronic devices.

Package Shape: SQUARE

The square package shape allows for efficient PCB layout and easy integration into various applications.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and functionality in a wide range of electronic devices.

Power Supplies (V): 9

A nominal supply voltage of 9V is a standard in many consumer applications, making it versatile and easy to integrate.

No. of Terminals: 44

With 44 terminals, this IC offers multiple connections for advanced features and flexibility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile design minimizes height, allowing for slim device profiles in modern electronics.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C provides reliability in harsh conditions, making it suitable for industrial use.

Minimum Operating Temperature: -40 °C

This IC can operate in extreme cold, ensuring functionality in a wide range of environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

A nickel palladium gold finish enhances corrosion resistance and ensures good electrical performance over time.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances soldering capabilities, improving manufacturability.

Maximum Seated Height: 1.6 mm

A low seated height allows for space-saving designs in compact electronic devices.

Width: 10 mm

A width of 10mm is a standard size that allows for compatibility with various circuit designs.

Minimum Supply Voltage (Vsup): 7.5 V

The ability to operate at a minimum of 7.5V allows flexibility in power supply options.

Length: 10 mm

A standardized length facilitates easier integration into various circuit designs and layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures high performance and reliability in challenging environments.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS processes, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and improve the mechanical strength of the package.

Maximum Supply Current: 40 mA

A maximum supply current of 40 mA provides sufficient power for various applications while maintaining low power consumption.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is compatible with modern PCB designs, enhancing flexibility for assembly.

Maximum Supply Voltage (Vsup): 10 V

Supporting a maximum supply voltage of 10V allows compatibility with a wide range of power sources.

Technical Specifications

Other Function Consumer ICs TDA7407 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7407 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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