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TDA7402

STMicroelectronics

TDA7402 by STMicroelectronics

TDA7402 by STMicroelectronics is a 44-terminal IC with power supply of 9V, operating b/w -40 to 85 °C. It is used in consumer circuits, featuring a low profile flatpack package suitable for industrial applications. With surface mount capability and Gull Wing terminals, it offers high performance with max supply current of 65mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,775 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,775

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-

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Vyrian

USA . 2,132 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,132

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Digiode

USA . 240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,127 parts In-Stock

1+ parts

$2.945

100+ parts

-

1k+ parts

$2.650

10k+ parts

-

1,127

$2.945

-

$2.650

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MKK Technologies

India . 1,173 parts In-Stock

1+ parts

$5.538

100+ parts

-

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-

10k+ parts

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1,173

$5.538

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DigiPath Technology Company

USA . 1,173 parts In-Stock

1+ parts

$5.538

100+ parts

-

1k+ parts

-

10k+ parts

-

1,173

$5.538

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-

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Microchip USA

USA . 155 parts In-Stock

1+ parts

$6.263

100+ parts

-

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-

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155

$6.263

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AZTECH Wire

Italy . 1,209 parts In-Stock

1+ parts

$13.200

100+ parts

-

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10k+ parts

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1,209

$13.200

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-

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A-Z Elektronik GmbH

Germany . 5,238 parts In-Stock

1+ parts

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5,238

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,000

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Corphita

USA . 1,513 parts In-Stock

1+ parts

-

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1,513

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-

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Parana Technologies

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$3.521

1k+ parts

-

10k+ parts

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735

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$3.521

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-

Overview

Discover the innovative TDA7402 by STMicroelectronics, a leading manufacturer renowned for its high-quality consumer ICs. This versatile product is perfect for a wide range of applications, offering customers unparalleled value and benefits. With a sleek square package body material and surface mount design, the TDA7402 provides reliability and efficiency. Whether you're looking to enhance your audio system or improve your electronic devices, this cutting-edge IC is the solution you've been searching for. Upgrade your technology today with the TDA7402 from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, this IC offers reliable performance and compatibility with a wide range of devices.

Power Supplies (V): 9

Operating at a supply voltage of 9V provides sufficient power for the IC to function efficiently in consumer electronics.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The IC can operate in extremely cold temperatures as low as -40 °C, offering versatility for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance for reliable connections.

Width: 10 mm

Compact width of 10mm enables efficient space utilization in compact electronic devices.

Maximum Supply Current: 65 mA

With a maximum supply current of 65mA, the IC operates within safe current limits for stable and efficient performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the IC is sensitive to moisture but can be handled and stored with proper precautions.

Technical Specifications

Other Function Consumer ICs TDA7402 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Power Supplies (V):

9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

65 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7402 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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