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T435-600K

STMicroelectronics

T435-600K by STMicroelectronics

T435-600K by STMicroelectronics is a TRIAC with 4A max RMS on-state current, 35mA max DC gate trigger current, and 600V repetitive peak off-state voltage. It is used in applications requiring AC power control such as dimmers, motor speed controllers, and heating control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,685 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,685

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-

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Anansix

USA . 2,558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,558

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Digiode

USA . 1,502 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,502

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$2.377

100+ parts

-

1k+ parts

$2.140

10k+ parts

-

1,080

$2.377

-

$2.140

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MKK Technologies

India . 465 parts In-Stock

1+ parts

$4.470

100+ parts

-

1k+ parts

-

10k+ parts

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465

$4.470

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DigiPath Technology Company

USA . 465 parts In-Stock

1+ parts

$4.470

100+ parts

-

1k+ parts

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10k+ parts

-

465

$4.470

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-

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Corphita

USA . 781 parts In-Stock

1+ parts

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781

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Parana Technologies

USA . 269 parts In-Stock

1+ parts

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100+ parts

$2.842

1k+ parts

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10k+ parts

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269

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$2.842

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Overview

The T435-600K by STMicroelectronics is a top-of-the-line TRIAC that offers unmatched quality and reliability. With a maximum repetitive peak off-state voltage of 600V and a maximum RMS on-state current of 4A, this TRIAC is perfect for a wide range of applications. Whether you're looking to control the power in lighting systems or appliances, this product delivers exceptional performance every time. Trust STMicroelectronics to provide you with the best-in-class components for your projects. Upgrade to the T435-600K today and experience the difference in quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the TRIAC, ensuring long-lasting performance.

Maximum DC Gate Trigger Current: 35 mA

High gate trigger current allows for reliable and consistent switching of the TRIAC, making it suitable for various applications.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and installation process, making it easier to implement in different systems.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, making it suitable for space-constrained applications.

Terminal Form: GULL WING

Gull wing terminals offer secure connections and ease of soldering, ensuring reliable electrical contact.

No. of Terminals: 3

Three terminals provide the necessary connections for proper operation and control of the TRIAC in various circuit configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for easy mounting and installation in different devices or equipment.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance in demanding environments, extending the product's reliability.

Trigger Device Type: TRIAC

Being a TRIAC, this device is well-suited for AC power control applications, providing efficient switching and regulation capabilities.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions, expanding the range of applications for this TRIAC.

Maximum RMS On-state Current: 4 A

High maximum RMS on-state current handling capability enables the TRIAC to control high power loads effectively.

Maximum DC Gate Trigger Voltage: 1.5 V

Low gate trigger voltage ensures efficient and reliable triggering of the TRIAC, enhancing its overall performance.

Case Connection: ISOLATED

Isolated case connection improves safety and protection for the users and surrounding components, reducing the risk of electrical hazards.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating provides sufficient insulation and protection against voltage surges, enhancing the reliability of the TRIAC.

Minimum Critical Rate of Rise of Commutation Voltage: 3.5 V/us

Fast critical rate of rise of commutation voltage ensures quick and efficient switching characteristics, improving the TRIAC's performance in dynamic applications.

Minimum Critical Rate of Rise of Off-state Voltage: 250 V/us

Fast critical rate of rise of off-state voltage enhances the TRIAC's ability to switch rapidly between on-state and off-state, optimizing its efficiency.

Maximum Holding Current: 35 mA

High maximum holding current ensures the TRIAC remains in the conducting state without any external trigger, providing stability in the circuit operation.

Technical Specifications

Triode For Alternating Current (TRIAC) T435-600K attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

3.5 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

250 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSFM-G3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

T435-600K Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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