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T2550H-600T

STMicroelectronics

T2550H-600T by STMicroelectronics

T2550H-600T by STMicroelectronics is a TRIAC with 25A RMS on-state current, 50mA DC gate trigger current, and 600V repetitive peak off-state voltage. It is used in applications requiring snubberless TRIACs for AC power control at temperatures ranging from -40 °C to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

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Zilex Electronics Inc.

Canada . 8,000 parts In-Stock

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Vyrian

USA . 4,258 parts In-Stock

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Anansix

USA . 2,864 parts In-Stock

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Digiode

USA . 980 parts In-Stock

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980

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ECAB

Sweden . 535 parts In-Stock

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535

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 38 parts In-Stock

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R&J Components

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Fibra_Brandt Electronic GMBH

Germany . 7 parts In-Stock

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IDEA Electronic Components Group

UK . 311 parts In-Stock

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$3.655

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$3.290

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MKK Technologies

India . 1,442 parts In-Stock

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$6.873

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DigiPath Technology Company

USA . 1,442 parts In-Stock

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$6.873

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Corphita

USA . 4,009 parts In-Stock

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Parana Technologies

USA . 2,001 parts In-Stock

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$4.370

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SIE Connect GmbH (Excess)

Germany . 475 parts In-Stock

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Kepictronics

USA . 90 parts In-Stock

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Overview

Discover the T2550H-600T by STMicroelectronics, a top-tier manufacturer known for its high-quality TRIAC products. Ideal for a wide range of applications, this snubberless TRIAC offers unparalleled value and benefits to customers. With a maximum RMS on-state current of 25A and a repetitive peak off-state voltage of 600V, this TRIAC is designed to deliver superior performance and reliability. Whether you're looking for a reliable solution for your lighting control or heating applications, the T2550H-600T is the perfect choice for your needs. Experience the quality and efficiency that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and durability, making the product reliable for long-term use.

Maximum DC Gate Trigger Current: 50 mA

The high DC gate trigger current allows for precise control and reliable triggering of the TRIAC.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easy to integrate into various applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and fit into different types of circuit layouts.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer a secure and reliable connection, ensuring stability in the circuit.

Maximum Leakage Current: 8.5 mA

Low leakage current ensures efficient operation and minimizes power wastage.

No. of Terminals: 3

The three terminals provide flexibility in circuit connections and compatibility with various systems.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy installation and secure mounting in different applications.

Maximum Operating Temperature: 150 °C

High operating temperature range ensures stability and performance under varying environmental conditions.

Trigger Device Type: SNUBBERLESS TRIAC

Snubberless TRIAC design reduces electromagnetic interference and simplifies circuit design.

Minimum Operating Temperature: -40 °C

Wide temperature tolerance enables reliable operation in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: SINGLE

Single terminal position simplifies wiring and connections, enhancing ease of use.

Maximum RMS On-state Current: 25 A

High RMS on-state current capacity allows for handling high power loads with efficiency.

Maximum DC Gate Trigger Voltage: 1.3 V

Low gate trigger voltage ensures energy-efficient performance and precise control.

Case Connection: MAIN TERMINAL 2

Main terminal connection simplifies circuit layout and offers easy connectivity in the system.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating ensures robust performance and protection against voltage fluctuations.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Fast rate of rise of off-state voltage ensures quick response and protection in high voltage conditions.

Maximum Holding Current: 75 mA

High holding current capacity ensures stable operation and minimizes false triggering in the circuit.

Technical Specifications

Triode For Alternating Current (TRIAC) T2550H-600T attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

75 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

8.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T2550H-600T Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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