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T2550H-600TRG

STMicroelectronics

T2550H-600TRG by STMicroelectronics

T2550H-600TRG by STMicroelectronics is a snubberless TRIAC designed for AC control applications. It features a max RMS on-state current of 25 A, repetitive peak off-state voltage of 600 V, and operates b/w -40 °C to 150 °C. Ideal for motor control and lighting systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,735 parts In-Stock

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7,735

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Digiode

USA . 1,927 parts In-Stock

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1,927

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Anansix

USA . 1,123 parts In-Stock

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1,123

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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200

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Distributors (Availability)

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Andel Nordic

Denmark . 4,731 parts In-Stock

1+ parts

$2.962

100+ parts

-

1k+ parts

$2.844

10k+ parts

$2.844

4,731

$2.962

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$2.844

$2.844

IDEA Electronic Components Group

UK . 1,180 parts In-Stock

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$3.724

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-

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$3.352

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1,180

$3.724

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$3.352

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MKK Technologies

India . 1,986 parts In-Stock

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$7.003

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1,986

$7.003

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DigiPath Technology Company

USA . 1,986 parts In-Stock

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$7.003

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1,986

$7.003

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AZTECH Wire

Italy . 357 parts In-Stock

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$18.790

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357

$18.790

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Component Stockers USA

USA . 642 parts In-Stock

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$99.990

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642

$99.990

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Perfect Parts

USA . 44,800 parts In-Stock

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44,800

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Kepictronics

USA . 20,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 20,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 5,436 parts In-Stock

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5,436

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Parana Technologies

USA . 1,270 parts In-Stock

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$4.453

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1,270

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$4.453

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Corphita

USA . 708 parts In-Stock

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708

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Overview

Unlock the power of innovation with the T2550H-600TRG from STMicroelectronics, a leader in semiconductor technology. This high-performance TRIAC delivers unmatched reliability and efficiency for your AC applications, ensuring smooth operation across various industries. With its robust design and superior thermal management, it minimizes downtime while maximizing performance. Elevate your projects with STMicroelectronics' commitment to quality and excellence—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 50 mA

A maximum gate trigger current of 50 mA allows for efficient and effective operation in switching applications.

Configuration: SINGLE

The single configuration simplifies design and integration into circuits, making it user-friendly for engineers.

Package Shape: RECTANGULAR

The rectangular package shape promotes easy mounting and layout flexibility in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides excellent mechanical stability and is ideal for high-power applications.

Maximum Leakage Current: 8.5 mA

A low maximum leakage current enhances the efficiency of the device, minimizing power loss and heat generation.

No. of Terminals: 3

Having three terminals allows for versatile circuit connections and simplifies interfacing with other components.

Package Style (Meter): FLANGE MOUNT

Flange mounting style provides secure installation and ensures reliable electrical performance in a variety of environments.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature enables the TRIAC to function effectively in extreme thermal conditions.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces component count and simplifies the circuit, enhancing reliability and reducing costs.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures makes this TRIAC suitable for outdoor and harsh environment applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent corrosion resistance and solderability, ensuring durable connections.

Terminal Position: SINGLE

A single terminal position allows for straightforward installation, aiding ease of use in circuit designs.

Maximum RMS On-state Current: 25 A

With a maximum RMS on-state current of 25 A, this TRIAC can handle substantial loads, making it suitable for high-power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low maximum gate trigger voltage enhances overall power efficiency during operation, making this TRIAC economical.

Case Connection: MAIN TERMINAL 2

Direct main terminal connection improves the overall performance and simplifies the device integration.

Repetitive Peak Off-state Voltage: 600 V

A high repetitive peak off-state voltage indicates robust performance in high-voltage environments, enabling its use in diverse applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/µs

A minimum critical rate of rise ensures that the TRIAC withstands rapid voltage changes without failure, enhancing reliability.

Maximum Holding Current: 75 mA

The maximum holding current of 75 mA allows the TRIAC to maintain operation in low-power applications, providing versatility.

Technical Specifications

Triode For Alternating Current (TRIAC) T2550H-600TRG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

75 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

8.5 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

25 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T2550H-600TRG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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