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T1220-400W

STMicroelectronics

T1220-400W by STMicroelectronics

STMicroelectronics T1220-400W is a single TRIAC with 20mA DC gate trigger current, 12A RMS on-state current, and 400V repetitive peak off-state voltage. Ideal for snubberless applications in temperature range -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,156 parts In-Stock

1+ parts

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4,156

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Vyrian

USA . 2,940 parts In-Stock

1+ parts

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2,940

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Anansix

USA . 212 parts In-Stock

1+ parts

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100+ parts

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212

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,168 parts In-Stock

1+ parts

$2.188

100+ parts

-

1k+ parts

$1.969

10k+ parts

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2,168

$2.188

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$1.969

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MKK Technologies

India . 262 parts In-Stock

1+ parts

$4.114

100+ parts

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262

$4.114

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DigiPath Technology Company

USA . 262 parts In-Stock

1+ parts

$4.114

100+ parts

-

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262

$4.114

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Corphita

USA . 4,026 parts In-Stock

1+ parts

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4,026

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Parana Technologies

USA . 1,817 parts In-Stock

1+ parts

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100+ parts

$2.616

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1,817

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$2.616

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Overview

Discover the power of the T1220-400W by STMicroelectronics, a high-quality TRIAC designed for a wide range of applications. With a focus on reliability and performance, STMicroelectronics delivers cutting-edge technology in a convenient package. Ideal for controlling AC power in various systems, this TRIAC offers unparalleled value and benefits to customers seeking efficiency and precision. Trust STMicroelectronics for innovative solutions that enhance your projects and elevate your results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes the product lightweight and durable.

Maximum DC Gate Trigger Current: 20 mA

With a high maximum DC gate trigger current, this product ensures reliable and consistent triggering of the TRIAC.

Configuration: SINGLE

Single configuration simplifies the wiring and installation process of the TRIAC, making it user-friendly.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into various electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and stable connections for the TRIAC.

Maximum Leakage Current: 0.01 mA

Low maximum leakage current ensures minimal power loss and improved efficiency of the TRIAC.

No. of Terminals: 3

Having 3 terminals simplifies the connection setup and enhances the overall functionality of the TRIAC.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers convenient and secure mounting options for the TRIAC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Trigger Device Type: SNUBBERLESS TRIAC

The use of snubberless TRIAC technology helps in reducing electromagnetic interference and improving overall performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for the TRIAC to function effectively in colder environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides corrosion resistance and ensures long-term reliability of the connections.

Terminal Position: SINGLE

Single terminal position simplifies the installation process and ensures proper alignment of the TRIAC.

Maximum RMS On-state Current: 12 A

High maximum RMS on-state current capacity allows the TRIAC to handle heavy loads effectively.

Maximum DC Gate Trigger Voltage: 1.5 V

Low maximum DC gate trigger voltage ensures efficient triggering of the TRIAC with minimal power consumption.

Case Connection: ISOLATED

Isolated case connection helps in preventing electrical interference and ensures safe operation of the TRIAC.

Repetitive Peak Off-state Voltage: 400 V

With a high repetitive peak off-state voltage, this TRIAC can handle high voltage applications with ease.

Minimum Critical Rate of Rise of Commutation Voltage: 10 V/us

Minimum critical rate of rise of commutation voltage ensures fast and stable switching of the TRIAC.

Minimum Critical Rate of Rise of Off-state Voltage: 200 V/us

High minimum critical rate of rise of off-state voltage ensures reliable turn-off performance of the TRIAC.

Reference Standard: UL RECOGNIZED

UL recognized certification ensures compliance with safety standards and guarantees the quality of the product.

Technical Specifications

Triode For Alternating Current (TRIAC) T1220-400W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

10 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

200 V/us

Maximum DC Gate Trigger Current:

20 mA

Maximum DC Gate Trigger Voltage:

1.5 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1220-400W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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