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T1205-600G

STMicroelectronics

T1205-600G by STMicroelectronics

STMicroelectronics T1205-600G is a single TRIAC with 12A RMS current and 600V repetitive peak off-state voltage. It operates b/w -40 to 125 °C, with a max gate trigger current of 5mA. Ideal for snubberless applications in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,910 parts In-Stock

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7,910

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Anansix

USA . 1,493 parts In-Stock

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1,493

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Digiode

USA . 819 parts In-Stock

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819

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Zilex Electronics Inc.

Canada . 100 parts In-Stock

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100

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Distributors (Availability)

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Advanced Electronics

New Zealand . 4,874 parts In-Stock

1+ parts

$2.568

100+ parts

$2.337

1k+ parts

$2.106

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4,874

$2.568

$2.337

$2.106

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IDEA Electronic Components Group

UK . 826 parts In-Stock

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$4.042

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$3.637

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826

$4.042

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$3.637

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MKK Technologies

India . 2,150 parts In-Stock

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$7.600

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2,150

$7.600

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DigiPath Technology Company

USA . 2,150 parts In-Stock

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$7.600

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$7.600

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AZTECH Wire

Italy . 880 parts In-Stock

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$15.930

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880

$15.930

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Component Stockers USA

USA . 484 parts In-Stock

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$99.990

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484

$99.990

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 4,233 parts In-Stock

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Parana Technologies

USA . 1,430 parts In-Stock

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$4.832

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$4.832

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Overview

Looking for a reliable and efficient Triode For Alternating Current (TRIAC)? Look no further than the T1205-600G by STMicroelectronics. With a reputation for quality and precision, STMicroelectronics delivers cutting-edge technology in a durable plastic/epoxy package. Ideal for a variety of applications, this SNUBBERLESS TRIAC offers a maximum RMS On-state Current of 12A and a Repetitive Peak Off-state Voltage of 600V. Experience the value and benefits of superior performance with the T1205-600G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the product.

Maximum DC Gate Trigger Current: 5 mA

The low DC gate trigger current allows for efficient and precise control of the triac, making it suitable for a wide range of applications.

Configuration: SINGLE

Single configuration simplifies the design and installation process, making it easy to integrate into existing systems.

Surface Mount: YES

Surface mount capability enables easy and space-saving installation on PCBs, making it ideal for compact electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact form factor, allowing for easy placement in various electronic designs.

Terminal Form: GULL WING

Gull wing terminal form offers secure connections and ease of soldering during assembly.

Maximum Leakage Current: 1 mA

Low maximum leakage current ensures minimal power loss and efficient operation of the device.

No. of Terminals: 2

Having only 2 terminals simplifies the wiring process and reduces the chances of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for high-density mounting on PCBs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this triac can withstand harsh environmental conditions and operate reliably in various applications.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces electromagnetic interference and improves efficiency in switching applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the triac to function effectively in cold environments without sacrificing performance.

Terminal Position: SINGLE

Single terminal position simplifies connection and installation, making it user-friendly for technicians and engineers.

Maximum RMS On-state Current: 12 A

The high maximum RMS on-state current rating enables the triac to handle heavy loads and high-power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

Low gate trigger voltage ensures efficient control and operation of the triac, reducing power consumption and heat generation.

Case Connection: MAIN TERMINAL 2

Main terminal connection simplifies the wiring process and ensures secure and reliable operation of the triac.

Repetitive Peak Off-state Voltage: 600 V

High repetitive peak off-state voltage allows the triac to withstand high voltage peaks, making it suitable for industrial and commercial applications.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/us

Low minimum critical rate of rise of off-state voltage ensures smooth and stable operation of the triac, protecting it from voltage spikes and transients.

Maximum Holding Current: 10 mA

High maximum holding current ensures that the device remains in the on-state even in the presence of external disturbances or noise.

Technical Specifications

Triode For Alternating Current (TRIAC) T1205-600G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

10 mA

JESD-30 Code:

R-PSSO-G2

Maximum Leakage Current:

1 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

12 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T1205-600G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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