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STY34NK80Z

STMicroelectronics

STY34NK80Z by STMicroelectronics

STY34NK80Z by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 28 A and a breakdown voltage of 800 V. It operates in enhancement mode with a power dissipation of up to 450 W. This robust transistor is suitable for high-temperature environments, reaching up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,606 parts In-Stock

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4,606

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Digiode

USA . 4,092 parts In-Stock

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4,092

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Anansix

USA . 914 parts In-Stock

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914

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

1+ parts

$1.060

100+ parts

-

1k+ parts

$0.954

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1,809

$1.060

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$0.954

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MKK Technologies

India . 1,891 parts In-Stock

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$1.993

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1,891

$1.993

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DigiPath Technology Company

USA . 1,891 parts In-Stock

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$1.993

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1,891

$1.993

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Corphita

USA . 3,156 parts In-Stock

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3,156

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Parana Technologies

USA . 1,642 parts In-Stock

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$1.267

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$1.267

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Overview

Elevate your designs with the STY34NK80Z from STMicroelectronics, a pinnacle of reliability and performance in power FETs. This N-channel transistor seamlessly handles high voltages up to 800V, making it perfect for demanding switching applications. With STMicroelectronics' commitment to quality, you benefit from enhanced efficiency and durability, ensuring your projects achieve optimal performance while enjoying peace of mind in reliability and longevity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability, electrical insulation, and protection against environmental factors, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

As an N-channel FET, it offers high electron mobility, resulting in better performance and efficiency in applications that require fast switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing inherent protection against reverse current, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Optimized for switching applications, this FET facilitates high-speed operations, making it an excellent choice for power management and control systems.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high voltage applications safely, enhancing its versatility in various electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards, facilitating easier integration into compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ease of assembly, making it suitable for both prototyping and production environments.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation ensures low power consumption when off and high performance when on, making it ideal for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 112 A

Capable of handling high pulsed currents, this FET is suitable for demanding applications, ensuring reliable performance under peak loads.

Maximum Drain Current (Abs) (ID): 28 A

Supporting substantial continuous current, this component is reliable in sustaining performance in high-current applications.

No. of Terminals: 3

With three terminals, this FET offers simplicity in connection and circuit configuration, facilitating easy integration into designs.

Maximum Power Dissipation (Abs): 450 W

High power dissipation capability ensures that the FET can handle significant power loads without overheating, enhancing long-term operation.

Package Style (Meter): IN-LINE

The in-line package style is well-suited for various PCB layouts and can aid in efficient thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance, low power consumption, and fast switching speeds, making this FET suitable for modern high-performance applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature threshold, this FET can function reliably in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon provides a reliable and cost-effective semiconductor material with established performance characteristics, making it a trusted choice.

Maximum Drain Current (ID): 28 A

The ability to handle up to 28 A continuously ensures stable performance in a wide range of power applications.

Maximum Drain-Source On Resistance: 0.24 ohm

Low on-resistance reduces power losses during operation, contributing to greater efficiency and cooler operation in power-switching applications.

Terminal Position: SINGLE

A single terminal position simplifies the circuit layout and assembly, making it less complex for circuit designers and engineers.

Technical Specifications

Power Field Effect Transistors (FET) STY34NK80Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

28 A

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.24 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STY34NK80Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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