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STY30NK90Z

STMicroelectronics

STY30NK90Z by STMicroelectronics

STY30NK90Z by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 900V breakdown voltage and 26A max drain current. It offers a built-in diode and operates in enhancement mode with a power dissipation of 450W. This robust transistor is suitable for high-temperature environments up to 150 °C.

Median Price

-

Lifecycle Status

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4

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1k+

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Vyrian

USA . 6,239 parts In-Stock

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Chip Stock

USA . 4,059 parts In-Stock

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Anansix

USA . 1,938 parts In-Stock

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Digiode

USA . 57 parts In-Stock

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IDEA Electronic Components Group

UK . 1,497 parts In-Stock

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$0.825

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$0.743

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1,497

$0.825

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$0.743

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MKK Technologies

India . 1,895 parts In-Stock

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$1.552

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$1.552

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DigiPath Technology Company

USA . 1,895 parts In-Stock

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$1.552

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$1.552

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AZTECH Wire

Italy . 856 parts In-Stock

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$21.960

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856

$21.960

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Component Stockers USA

USA . 282 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,589 parts In-Stock

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Corphita

USA . 4,252 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,100 parts In-Stock

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Parana Technologies

USA . 539 parts In-Stock

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$0.987

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Assy Fe

Spain . 390 parts In-Stock

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iodParts Technologies Inc.

India . 350 parts In-Stock

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Kepictronics

USA . 102 parts In-Stock

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Overview

Elevate your projects with the STY30NK90Z from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel power FET delivers exceptional reliability and efficiency for your switching applications. With its robust design and built-in diode, it ensures seamless operation even in demanding environments. Trust in STMicroelectronics' legacy of quality to drive your designs forward, maximizing performance while minimizing energy consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers good mechanical strength and durability, making the FET robust for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide higher efficiency and faster operation, making them suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode improves protection against reverse polarity and enhances performance in switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle quick on-off states, making it ideal for modern digital circuits.

Minimum DS Breakdown Voltage: 900 V

The high breakdown voltage allows this FET to be used in high-voltage applications, providing versatility in design.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier integration into printed circuit boards (PCBs), optimizing space usage.

Terminal Form: THROUGH-HOLE

Through-hole technology offers better mechanical stability in high-power applications, ensuring a secure connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs support low gate voltage operation, resulting in better efficiency and reduced power consumption.

Maximum Pulsed Drain Current (IDM): 104 A

The ability to handle a high pulsed drain current makes this FET suitable for applications requiring temporary high loads.

Avalanche Energy Rating (EAS): 500 mJ

With a high avalanche energy rating, this FET is resilient against transient energy events, improving reliability.

Maximum Drain Current (Abs) (ID): 26 A

A maximum drain current rating of 26 A enhances its capability to drive loads effectively in power applications.

No. of Terminals: 3

The three-terminal design simplifies circuit integration while offering flexibility in configuration for various applications.

Maximum Power Dissipation (Abs): 450 W

High power dissipation allows the FET to operate under heavy loads without overheating, suitable for demanding environments.

Package Style (Meter): IN-LINE

The in-line style facilitates easy assembly and disassembly in circuit boards, enhancing manufacturability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOS technology improves efficiency and speed, making it ideal for high-frequency and power applications.

Maximum Operating Temperature: 150 °C

A high operating temperature capability ensures reliability in extreme environments, suitable for automotive and industrial use.

Transistor Element Material: SILICON

Silicon is widely used in FETs for its excellent electrical properties, ensuring performance consistency.

Terminal Finish: Matte Tin (Sn)

The matte tin finish offers good solderability and corrosion resistance, enhancing the longevity of the connections.

Maximum Drain Current (ID): 26 A

With a maximum drain current rating of 26 A, it efficiently manages power without excessive heat generation.

Maximum Drain-Source On Resistance: 0.26 ohm

Low on-resistance ensures minimal power losses during operation, improving overall efficiency and performance.

Terminal Position: SINGLE

Single terminal position simplifies the design and layout of circuits, making assembly more straightforward.

Case Connection: ISOLATED

An isolated case connection enhances safety by preventing unwanted electrical interference with other components.

Technical Specifications

Power Field Effect Transistors (FET) STY30NK90Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

26 A

Maximum Drain Current (ID):

26 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

104 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STY30NK90Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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