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STY34NB50F

STMicroelectronics

STY34NB50F by STMicroelectronics

STY34NB50F by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 500V breakdown voltage and a max drain current of 34A. It has a built-in diode and operates in enhancement mode. With a power dissipation of 450W, it's suitable for high-performance circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,471 parts In-Stock

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4,471

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Digiode

USA . 3,642 parts In-Stock

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3,642

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Anansix

USA . 1,905 parts In-Stock

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1,905

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ACDS - Activité Composants Distribution Service

France . 27 parts In-Stock

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27

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,183 parts In-Stock

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$1.013

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-

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$0.912

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1,183

$1.013

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$0.912

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MKK Technologies

India . 2,198 parts In-Stock

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$1.905

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2,198

$1.905

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DigiPath Technology Company

USA . 2,198 parts In-Stock

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$1.905

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2,198

$1.905

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Ampacity Inc.

Singapore . 378 parts In-Stock

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$8.050

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378

$8.050

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Corphita

USA . 3,641 parts In-Stock

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3,641

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 420 parts In-Stock

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$1.211

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420

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$1.211

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Overview

Unlock the power of seamless performance with the STY34NB50F from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This N-channel power FET excels in high-voltage switching applications, delivering unparalleled efficiency and reliability. With its robust design supporting extreme conditions, it ensures optimal operation in diverse environments—from industrial machinery to consumer electronics—empowering your projects with unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material contributes to enhanced durability and reliability, making it suitable for various application environments.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration is often preferred for switching applications due to lower on-resistance, leading to better efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode improves the overall circuit design by reducing component count and enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures rapid response times and efficient switching characteristics.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage adds reliability for high-voltage applications, protecting against accidental overvoltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, making it ideal for compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering for durable connections in electronic circuits.

Operating Mode: ENHANCEMENT MODE

The enhancement mode allows for low power consumption when the device is in the off state, improving overall energy efficiency.

Maximum Pulsed Drain Current (IDM): 136 A

This high pulsed drain current capacity makes it suitable for applications that require handling of transient currents.

Avalanche Energy Rating (EAS): 1000 mJ

A high avalanche energy rating indicates the ability to withstand high-energy transients, providing additional protection in challenging environments.

Maximum Drain Current (Abs) (ID): 34 A

The maximum drain current rating of 34 A supports robust performance in high-current applications, enhancing the device's versatility.

No. of Terminals: 3

The three terminal arrangement simplifies circuit design while providing all necessary connections for efficient operation.

Maximum Power Dissipation (Abs): 450 W

A maximum power dissipation rating of 450 W allows the FET to handle substantial power loads, making it suitable for high-power applications.

Package Style (Meter): IN-LINE

The in-line package style provides ease of installation and assembly in electronic circuits, saving time and resources.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers excellent efficiency and scalability for modern electronic applications, enhancing performance and reliability.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C makes this FET suitable for demanding environments, ensuring reliable performance in extreme conditions.

Transistor Element Material: SILICON

Silicon as the element material is well-known for its excellent electronic properties, ensuring high performance and stability.

Maximum Drain-Source On Resistance: 0.14 ohm

A low on-resistance value contributes to reduced power loss and improved efficiency, making it a great choice for high-efficiency applications.

Terminal Position: SINGLE

Having a single terminal position simplifies design and integration into various circuits, enhancing the versatility of the device.

Technical Specifications

Power Field Effect Transistors (FET) STY34NB50F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

1000 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

34 A

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

136 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STY34NB50F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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