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STWA75N65DM6

STMicroelectronics

STWA75N65DM6 by STMicroelectronics

STWA75N65DM6 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 75A max drain current, and 480W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

$14.100

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 80 parts In-Stock

1+ parts

$9.660

100+ parts

$7.080

1k+ parts

-

10k+ parts

-

80

$9.660

$7.080

-

-

Mouser Electronics

USA . 398 parts In-Stock

1+ parts

$14.100

100+ parts

$9.160

1k+ parts

$8.740

10k+ parts

-

398

$14.100

$9.160

$8.740

-

DigiKey

USA . 3 parts In-Stock

1+ parts

$14.100

100+ parts

$10.255

1k+ parts

$8.935

10k+ parts

$8.743

3

$14.100

$10.255

$8.935

$8.743

Newark

USA . 88 parts In-Stock

1+ parts

$17.510

100+ parts

$13.140

1k+ parts

$12.670

10k+ parts

-

88

$17.510

$13.140

$12.670

-

Element14

Singapore . 80 parts In-Stock

1+ parts

$18.120

100+ parts

$12.990

1k+ parts

$12.580

10k+ parts

-

80

$18.120

$12.990

$12.580

-

Avnet

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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600

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,153 parts In-Stock

1+ parts

$7.049

100+ parts

-

1k+ parts

-

10k+ parts

-

4,153

$7.049

-

-

-

Vyrian

USA . 7,857 parts In-Stock

1+ parts

-

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-

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7,857

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Anansix

USA . 336 parts In-Stock

1+ parts

-

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336

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

$0.742

10k+ parts

-

1,546

$0.824

-

$0.742

-

MKK Technologies

India . 1,244 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

$1.550

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-

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DigiPath Technology Company

USA . 1,244 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

$1.550

-

-

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Corphita

USA . 102 parts In-Stock

1+ parts

$6.678

100+ parts

-

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-

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102

$6.678

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-

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Continental Prestige Electronics

USA . 97 parts In-Stock

1+ parts

$12.010

100+ parts

$8.780

1k+ parts

-

10k+ parts

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97

$12.010

$8.780

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Microchip USA

USA . 439 parts In-Stock

1+ parts

$40.096

100+ parts

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439

$40.096

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Parana Technologies

USA . 1,904 parts In-Stock

1+ parts

-

100+ parts

$0.986

1k+ parts

-

10k+ parts

-

1,904

-

$0.986

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Alle Elektronik GmbH

Germany . 855 parts In-Stock

1+ parts

-

100+ parts

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855

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Overview

Unlock unparalleled efficiency and reliability with the STWA75N65DM6 from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel Power FET excels in demanding applications, delivering robust performance for industrial and energy solutions. Enjoy lower energy consumption and seamless operation under extreme conditions, backed by ST's commitment to quality. Elevate your designs with this powerful switching transistor that promises unmatched value and dependable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable plastic/epoxy body provides protection against environmental factors, enhancing the longevity and reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are generally preferred for high-speed switching applications due to their lower on-resistance and higher efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode functionality allows for better energy management, useful in applications requiring fast switching and preventing reverse polarity damage.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high efficiency and fast response times critical in power management systems.

Minimum DS Breakdown Voltage: 650 V

With a breakdown voltage of 650V, this FET is suitable for high-voltage applications, enhancing its versatility in various electronic circuits.

Package Shape: RECTANGULAR

The rectangular package aids in efficient space utilization on PCB layouts, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and ease of soldering, making them suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for control over the channel when voltage is applied, enabling finer control in circuits.

Maximum Pulsed Drain Current (IDM): 280 A

A pulsed drain current rating of 280A makes this FET ideal for demanding power applications and heavy-duty switching.

Avalanche Energy Rating (EAS): 1900 mJ

This high avalanche energy rating means the FET can safely handle energy spikes without damage, increasing reliability.

No. of Terminals: 3

With three terminals, it offers simplicity in integration, reducing complexity in circuit design.

Maximum Power Dissipation (Abs): 480 W

A maximum power dissipation of 480W allows this transistor to handle significant heat, which is essential for power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures stable mounting and effective heat dissipation, making it suitable for high-power circuits.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and efficiency, making this FET ideal for use in a wide range of electronic applications.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150 °C, this FET is suitable for high-temperature environments, enhancing its application range.

Transistor Element Material: SILICON

Silicon material ensures good thermal conductivity and reliable performance, essential for electronic components.

Minimum Operating Temperature: -55 °C

This wide operating temperature range makes it versatile for both industrial and automotive applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish prevents corrosion and aids in solderability, ensuring a stable connection.

Maximum Drain Current (ID): 75 A

A maximum drain current of 75A allows it to manage significant loads, making it suitable for high-performance power circuits.

Maximum Drain-Source On Resistance: 0.036 ohm

Low on-resistance minimizes energy losses during operation, improving overall efficiency in power applications.

Terminal Position: SINGLE

Single terminal position simplifies design and installation, allowing for easier integration into various configurations.

Case Connection: DRAIN

Direct connection to the drain offers efficient current flow, enhancing the performance of the FET in switching applications.

Maximum Feedback Capacitance (Crss): 3 pF

Low feedback capacitance enables faster switching speeds, making this FET a great choice for high-speed applications.

Technical Specifications

Power Field Effect Transistors (FET) STWA75N65DM6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1900 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STWA75N65DM6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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