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STWA40N60M2

STMicroelectronics

STWA40N60M2 by STMicroelectronics

STWA40N60M2 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 136A max pulsed drain current, and operates at temperatures from -55 °C to 150 °C. Ideal for high-power circuits with robust performance.

Median Price

$6.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 584 parts In-Stock

1+ parts

$6.620

100+ parts

$3.229

1k+ parts

$2.663

10k+ parts

-

584

$6.620

$3.229

$2.663

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,553 parts In-Stock

1+ parts

$5.196

100+ parts

-

1k+ parts

-

10k+ parts

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4,553

$5.196

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-

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Vyrian

USA . 4,182 parts In-Stock

1+ parts

-

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4,182

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Anansix

USA . 861 parts In-Stock

1+ parts

-

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861

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,085 parts In-Stock

1+ parts

$0.676

100+ parts

-

1k+ parts

$0.609

10k+ parts

-

2,085

$0.676

-

$0.609

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MKK Technologies

India . 620 parts In-Stock

1+ parts

$1.272

100+ parts

-

1k+ parts

-

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620

$1.272

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-

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DigiPath Technology Company

USA . 620 parts In-Stock

1+ parts

$1.272

100+ parts

-

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620

$1.272

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-

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Andel Nordic

Denmark . 2,443 parts In-Stock

1+ parts

$2.477

100+ parts

-

1k+ parts

$2.378

10k+ parts

$2.378

2,443

$2.477

-

$2.378

$2.378

Corphita

USA . 4,792 parts In-Stock

1+ parts

$4.923

100+ parts

-

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4,792

$4.923

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Microchip USA

USA . 346 parts In-Stock

1+ parts

$19.180

100+ parts

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346

$19.180

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

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15,000

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Parana Technologies

USA . 851 parts In-Stock

1+ parts

-

100+ parts

$0.808

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10k+ parts

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851

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$0.808

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Overview

Unlock the potential of your designs with the STWA40N60M2 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-quality N-channel power FET is engineered for exceptional performance in demanding switching applications, offering unmatched reliability and efficiency. With its robust construction and cutting-edge technology, it excels in everything from industrial automation to renewable energy systems, ensuring your projects achieve peak performance while reducing energy consumption. Choose STMicroelectronics for superior quality and peace of mind in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides a lightweight yet durable package, ensuring reliable performance in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher electron mobility, making them suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection against back EMF, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this transistor maximizes efficiency and reduces losses in power applications.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows for operation in higher voltage scenarios, making it versatile for demanding applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCB layouts, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical support and ease of soldering, ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide improved control over current flow, enhancing efficiency and reducing power loss.

Maximum Pulsed Drain Current (IDM): 136 A

Capable of handling high pulsed currents, making it suitable for applications with short bursts of high current demands.

Avalanche Energy Rating (EAS): 500 mJ

With a high avalanche energy rating, this FET can withstand transient conditions, providing robust performance.

No. of Terminals: 3

The three-terminal design simplifies the circuit integration while still providing essential functionality.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability ensures that the transistor can handle substantial loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure mounting and heat dissipation in high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low power consumption and high-speed operation, enhancing overall system efficiency.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function effectively in extreme environments.

Transistor Element Material: SILICON

Silicon as a material ensures reliability and stability, offering well-established performance in electronic applications.

Minimum Operating Temperature: -55 °C

Wide operating temperature range makes it suitable for use in harsh conditions, enhancing versatility.

Maximum Drain Current (ID): 34 A

The capacity to handle 34 A ensures that it can manage substantial current loads effectively in various circuits.

Maximum Drain-Source On Resistance: 0.088 ohm

Low on-resistance minimizes energy loss and heat generation, enhancing the efficiency of power handling applications.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout and assembly, reducing design complexity.

Case Connection: DRAIN

Direct connection to the drain ensures efficient heat management and clear signal routing, aiding in stable operation.

Maximum Feedback Capacitance (Crss): 2.4 pF

Low feedback capacitance allows for faster switching speeds and improved performance in high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STWA40N60M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.088 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

2.4 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

136 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STWA40N60M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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