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STWA20N95DK5

STMicroelectronics

STWA20N95DK5 by STMicroelectronics

STWA20N95DK5 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 950V breakdown voltage and 72A max pulsed drain current. It operates in enhancement mode with a power dissipation of up to 250W. This robust transistor ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,657 parts In-Stock

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Digiode

USA . 1,947 parts In-Stock

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Anansix

USA . 1,098 parts In-Stock

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1,098

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IDEA Electronic Components Group

UK . 101 parts In-Stock

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$1.591

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$1.432

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101

$1.591

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$1.432

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MKK Technologies

India . 1,648 parts In-Stock

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$2.991

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$2.991

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DigiPath Technology Company

USA . 1,648 parts In-Stock

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$2.991

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AZTECH Wire

Italy . 957 parts In-Stock

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$8.700

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957

$8.700

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Microchip USA

USA . 4,572 parts In-Stock

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$15.908

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Component Stockers USA

USA . 1,078 parts In-Stock

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$76.090

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$76.090

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QUARKTWIN TECHNOLOGY LTD

USA . 19,956 parts In-Stock

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Alle Elektronik GmbH

Germany . 6,000 parts In-Stock

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Corphita

USA . 2,455 parts In-Stock

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Parana Technologies

USA . 2,297 parts In-Stock

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$1.902

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Overview

Unlock superior performance with the STWA20N95DK5 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality N-channel Power FET is engineered for efficient switching applications, offering remarkable reliability and exceptional energy handling. With its robust design and built-in diode, it delivers outstanding value, ensuring your circuits operate flawlessly even under demanding conditions. Elevate your projects with ST's trusted technology and experience unmatched benefits today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making it suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance, which helps improve efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The integrated diode allows for easier circuit design and improved reliability in applications where reverse polarity protection is needed.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is ideal for fast and efficient operation in power management scenarios.

Minimum DS Breakdown Voltage: 950 V

A high breakdown voltage enables operation in high-voltage applications, enhancing the FET's versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, while providing good thermal performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and ease of soldering, which is advantageous in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are generally more efficient and have a higher gain, making them suitable for precise control applications.

Maximum Pulsed Drain Current (IDM): 72 A

This high pulsed current rating allows the FET to handle transient loads efficiently, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 520 mJ

A substantial avalanche energy rating indicates resilience to voltage spikes and potential for safe operation in rugged environments.

No. of Terminals: 3

Three terminals simplify circuit design and increase flexibility for various configurations in use.

Maximum Power Dissipation (Abs): 250 W

A high power dissipation capability ensures reliable operation under heavy load conditions, enhancing overall performance.

Package Style (Meter): FLANGE MOUNT

Flange mount packages enable better heat dissipation and mechanical stability, important for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low drive power requirements, beneficial for low-power applications.

Maximum Operating Temperature: 150 °C

The ability to operate at elevated temperatures enhances reliability in harsh environments, making it suited for industrial use.

Transistor Element Material: SILICON

Silicon is a well-established material for FETs, providing good performance characteristics and broad availability.

Minimum Operating Temperature: -55 °C

The capability to function at low temperatures makes this FET suitable for environments with extreme thermal conditions.

Maximum Drain Current (ID): 18 A

A maximum drain current rating of 18 A allows for effective handling of substantial loads, ideal for power applications.

Maximum Drain-Source On Resistance: 0.33 ohm

Low on-resistance contributes to lower power losses, resulting in increased efficiency in circuit operation.

Terminal Position: SINGLE

Single terminal positioning simplifies layout design and lends to ease of integration into various configurations.

Case Connection: DRAIN

The drain case connection improves thermal performance and facilitates optimal heat dissipation.

Maximum Feedback Capacitance (Crss): 5 pF

Low feedback capacitance enhances switching speed and reduces signal distortion, improving performance in fast-switching applications.

Technical Specifications

Power Field Effect Transistors (FET) STWA20N95DK5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

520 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.33 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STWA20N95DK5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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