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STW54NK30Z

STMicroelectronics

STW54NK30Z by STMicroelectronics

STW54NK30Z by STMicroelectronics is a N-CHANNEL FET with 300V DS breakdown voltage, 54A max drain current, and 0.06 ohm on-resistance. Ideal for switching applications, it operates in enhancement mode with 200A pulsed drain current capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,254 parts In-Stock

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Digiode

USA . 1,727 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Anansix

USA . 414 parts In-Stock

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Corohmni

South Africa . 147 parts In-Stock

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$0.584

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147

$0.584

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Aztec Data Supply Inc.

USA . 1,411 parts In-Stock

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$0.624

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$0.624

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IDEA Electronic Components Group

UK . 1,979 parts In-Stock

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$1.834

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$1.650

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$1.834

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$1.650

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MKK Technologies

India . 1,990 parts In-Stock

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$3.448

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$3.448

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DigiPath Technology Company

USA . 1,990 parts In-Stock

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$3.448

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$3.448

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AZTECH Wire

Italy . 420 parts In-Stock

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$13.573

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$13.573

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Ampacity Inc.

Singapore . 1,320 parts In-Stock

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$64.050

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Lixinc

USA . 8,929 parts In-Stock

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Continental Prestige Electronics

USA . 3,941 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,461 parts In-Stock

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$2.192

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Alle Elektronik GmbH

Germany . 1,419 parts In-Stock

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Computer Components Inc. - USA

USA . 1,259 parts In-Stock

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Argo Parts USA

USA . 935 parts In-Stock

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Corphita

USA . 259 parts In-Stock

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Overview

Unleash the power of innovation with the STW54NK30Z from STMicroelectronics. As a leader in the industry, STMicroelectronics delivers unparalleled quality and reliability in their Power Field Effect Transistors. Ideal for switching applications, this N-Channel transistor offers a single configuration with a built-in diode, providing customers with enhanced performance and efficiency. Whether you're designing high-power systems or looking to optimize energy consumption, the STW54NK30Z is the perfect solution. Experience the value and benefits that come with choosing STMicroelectronics for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and stability for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors generally offer better efficiency and higher switching speeds compared to P-CHANNEL transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 300 V

With a high breakdown voltage, this transistor can handle higher voltages, making it suitable for demanding tasks.

Maximum Pulsed Drain Current (IDM): 200 A

Capable of handling high current pulses, making it suitable for applications that require high power.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability allows the transistor to handle high power levels without overheating.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures without compromising performance.

Maximum Drain-Source On Resistance: 0.06 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) STW54NK30Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (Abs) (ID):

54 A

Maximum Drain Current (ID):

54 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW54NK30Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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