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STW40N20

STMicroelectronics

STW40N20 by STMicroelectronics

STW40N20 by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 40 A and a breakdown voltage of 200 V. It offers low on-resistance at 0.045 Ω and operates up to 150 °C. This versatile transistor is suitable for high-power circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,824 parts In-Stock

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Digiode

USA . 4,390 parts In-Stock

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4,390

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Anansix

USA . 2,234 parts In-Stock

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2,234

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 519 parts In-Stock

1+ parts

$0.901

100+ parts

-

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$0.811

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519

$0.901

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$0.811

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MKK Technologies

India . 671 parts In-Stock

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$1.694

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671

$1.694

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DigiPath Technology Company

USA . 671 parts In-Stock

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$1.694

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671

$1.694

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AZTECH Wire

Italy . 276 parts In-Stock

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$19.770

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276

$19.770

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Component Stockers USA

USA . 541 parts In-Stock

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$99.990

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541

$99.990

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Alle Elektronik GmbH

Germany . 4,949 parts In-Stock

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Corphita

USA . 3,750 parts In-Stock

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3,750

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,522 parts In-Stock

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$1.077

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1,522

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$1.077

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Overview

Unlock unparalleled performance with the STW40N20 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, offering reliability and efficiency that enhance your designs. With robust construction and exceptional temperature tolerance, it’s perfect for demanding environments. Trust STMicroelectronics to deliver quality and value, empowering your projects with cutting-edge technology and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, contributing to a longer lifespan of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and high speed, making this product suitable for fast switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse voltage spikes, adding reliability in circuit applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in controlling high power loads efficiently.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage ensures that the FET can safely operate in demanding environments without failure.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs, facilitating better circuit design.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides a robust connection for high-power applications, ensuring stability and reliability in installations.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enhances performance in low-power applications, ensuring lower energy losses during operation.

Maximum Pulsed Drain Current (IDM): 160 A

High pulsed drain current capability enables this FET to handle substantial loads, ideal for high-performance applications.

Avalanche Energy Rating (EAS): 230 mJ

This rating allows the FET to withstand energy spikes, making it suitable for environments where voltage transients occur.

Maximum Drain Current (Abs) (ID): 40 A

With a maximum drain current of 40 A, this FET is capable of driving high-power devices efficiently.

No. of Terminals: 3

Three terminals simplify the design and connectivity of the FET within various circuit layouts.

Maximum Power Dissipation (Abs): 160 W

This ability to dissipate a substantial amount of power allows for high-performance operation without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount configuration provides easy mounting options and enhances thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables low gate drive power and high speed, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures increases reliability and allows use in demanding environments.

Transistor Element Material: SILICON

Silicon materials are widely used and trusted for their excellent electrical properties and efficiency.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring longevity in connections.

Maximum Drain Current (ID): 40 A

Reiterating the high current handling capacity, which is essential for reliable performance in power applications.

Maximum Drain-Source On Resistance: 0.045 ohm

A low on-resistance minimizes power loss and heat generation, enhancing overall circuit efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies the layout and reduces complexity in circuit designs.

Case Connection: DRAIN

Direct drain connection improves performance by minimizing resistance and further enhancing efficiency.

Technical Specifications

Power Field Effect Transistors (FET) STW40N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

160 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW40N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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