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STW35N65M5

STMicroelectronics

STW35N65M5 by STMicroelectronics

STW35N65M5 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 27A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,902 parts In-Stock

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Digiode

USA . 3,513 parts In-Stock

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3,513

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Anansix

USA . 2,568 parts In-Stock

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2,568

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ACDS - Activité Composants Distribution Service

France . 540 parts In-Stock

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540

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ComSIT Distribution GmbH

Germany . 270 parts In-Stock

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270

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Velocity Electronics

USA . 205 parts In-Stock

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205

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IDEA Electronic Components Group

UK . 96 parts In-Stock

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$0.353

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$0.318

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96

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$0.318

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MKK Technologies

India . 1,509 parts In-Stock

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$0.664

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1,509

$0.664

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DigiPath Technology Company

USA . 1,509 parts In-Stock

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$0.664

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$0.664

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$1.946

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$1.771

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$1.596

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$1.946

$1.771

$1.596

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AZTECH Wire

Italy . 42 parts In-Stock

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$8.240

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Authorized Procurement Solutions

USA . 84,000 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,496 parts In-Stock

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Parana Technologies

USA . 2,161 parts In-Stock

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$0.422

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Corphita

USA . 2,123 parts In-Stock

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Perfect Parts

USA . 1,982 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,614 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 540 parts In-Stock

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Glotronic Ltd.

UK . 432 parts In-Stock

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Overview

Elevate your power management solutions with the STW35N65M5 from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance N-channel FET excels in switching applications, offering exceptional efficiency and reliability. With its robust design and built-in diode, it ensures seamless operation even in demanding environments. Experience unmatched quality and performance—ideal for industrial automation, renewable energy systems, and automotive applications, making it the smart choice for engineers seeking to maximize their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent protection against environmental factors, enhancing the durability and reliability of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are typically faster and more efficient for switching applications, making them a preferred choice in high-frequency designs.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and enhances performance in applications where flyback diodes are necessary.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching times, suitable for a variety of power tasks.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage ensures reliability in high-voltage applications, preventing damage and ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards, facilitating compact designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting offers superior mechanical stability and is ideal for high-power applications where secure connections are required.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate drive requirements, improving control in power management applications.

Maximum Pulsed Drain Current (IDM): 108 A

The ability to handle high pulsed currents makes this FET suitable for demanding switching applications, providing significant performance headroom.

Avalanche Energy Rating (EAS): 800 mJ

A high avalanche energy rating means it can withstand energy spikes, enhancing its robustness in dynamic applications.

Maximum Drain Current (Abs) (ID): 27 A

With a maximum drain current of 27 A, this transistor is well-equipped to handle substantial loads in various power circuits.

No. of Terminals: 3

The 3-terminal design suits a range of configurations, facilitating simpler integration into different layouts.

Maximum Power Dissipation (Abs): 160 W

With a high power dissipation capability, this FET can efficiently manage thermal performance, reducing the risk of overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances heat dissipation and makes it easier to attach to a heatsink, improving thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low power loss, which is critical for efficient operation in electronic devices.

Maximum Operating Temperature: 150 °C

The high operating temperature threshold ensures reliability in harsh environments, expanding application possibilities.

Transistor Element Material: SILICON

Silicon as a semiconductor material offers good thermal stability and is widely used, ensuring compatibility with various components.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides excellent solderability and corrosion resistance, enhancing the longevity of the connections.

Maximum Drain-Source On Resistance: 0.098 ohm

Low on-resistance minimizes power losses during operation, increasing overall efficiency in power applications.

Terminal Position: SINGLE

Single terminal positioning allows for straightforward integration into circuit designs, making assembly easier.

Case Connection: ISOLATED

Isolated case connections enhance safety by preventing unintentional electrical interactions, crucial in high-voltage environments.

Technical Specifications

Power Field Effect Transistors (FET) STW35N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

27 A

Maximum Drain Current (ID):

27 A

Maximum Drain-Source On Resistance:

.098 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

108 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW35N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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