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STW25NM60ND

STMicroelectronics

STW25NM60ND by STMicroelectronics

STW25NM60ND from STMicroelectronics is a powerful N-channel MOSFET designed for switching applications. It features a 600V breakdown voltage, 21A max drain current, and 160W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Schukat

Germany . 5 parts In-Stock

1+ parts

$2.720

100+ parts

$1.980

1k+ parts

-

10k+ parts

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5

$2.720

$1.980

-

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Vyrian

USA . 5,016 parts In-Stock

1+ parts

-

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-

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5,016

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Digiode

USA . 2,959 parts In-Stock

1+ parts

-

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-

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2,959

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-

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Anansix

USA . 1,707 parts In-Stock

1+ parts

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1,707

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,111 parts In-Stock

1+ parts

$0.655

100+ parts

-

1k+ parts

$0.590

10k+ parts

-

2,111

$0.655

-

$0.590

-

MKK Technologies

India . 1,302 parts In-Stock

1+ parts

$1.232

100+ parts

-

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-

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1,302

$1.232

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DigiPath Technology Company

USA . 1,302 parts In-Stock

1+ parts

$1.232

100+ parts

-

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-

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1,302

$1.232

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AZTECH Wire

Italy . 247 parts In-Stock

1+ parts

$18.040

100+ parts

-

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247

$18.040

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Component Stockers USA

USA . 764 parts In-Stock

1+ parts

$99.990

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764

$99.990

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Perfect Parts

USA . 7,401 parts In-Stock

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7,401

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A-Z Elektronik GmbH

Germany . 6,566 parts In-Stock

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6,566

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Alle Elektronik GmbH

Germany . 4,411 parts In-Stock

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4,411

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Parana Technologies

USA . 2,041 parts In-Stock

1+ parts

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100+ parts

$0.783

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2,041

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$0.783

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GreenTree Electronics

Israel . 1,920 parts In-Stock

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1,920

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Corphita

USA . 1,546 parts In-Stock

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1,546

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock superior efficiency and reliability with the STW25NM60ND from STMicroelectronics, a leader in innovative semiconductor solutions. This N-Channel Power FET is expertly designed for high-performance switching applications, delivering unmatched durability with a robust 600V breakdown voltage. Ideal for industrial, automotive, and consumer electronics, it ensures optimal power management while minimizing energy loss, giving you exceptional value and performance that stands the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are often more efficient for power applications and provide higher switching speeds, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves reliability by providing protection against back EMF.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid ON/OFF cycles, making it ideal for power management.

Minimum DS Breakdown Voltage: 600 V

The high breakdown voltage allows the transistor to be used in high-voltage applications, increasing its versatility.

Package Shape: RECTANGULAR

The rectangular package shape contributes to efficient space utilization on PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide enhanced mechanical strength and are better suited for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides superior efficiency and better control in switching applications.

Maximum Pulsed Drain Current (IDM): 84 A

The high pulsed drain current capability allows the transistor to handle peak load conditions without failure.

Avalanche Energy Rating (EAS): 850 mJ

A high avalanche energy rating offers resilience against transient voltage spikes, enhancing reliability.

Maximum Drain Current (Abs): 21 A

The maximum drain current rating makes this product suitable for applications requiring significant current handling.

No. of Terminals: 3

Three terminals simplify circuit design while providing essential connectivity features.

Maximum Power Dissipation (Abs): 160 W

With a high power dissipation rating, this FET can efficiently manage heat in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style enhances thermal management and physical stability in mounted applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for lower on-resistance and quicker switching times, improving efficiency and performance.

Maximum Operating Temperature: 150 °C

High maximum operating temperature supports reliability and performance in demanding environments.

Transistor Element Material: SILICON

Silicon offers excellent thermal stability and efficient electronic properties, making it ideal for power FETs.

Terminal Finish: TIN

Tin terminal finish provides good solderability and helps prevent oxidation, ensuring long-term reliability.

Maximum Drain Current (ID): 21 A

This specification reinforces the transistor's ability to drive heavy loads, making it effective in power applications.

Maximum Drain-Source On Resistance: 0.16 ohm

Low on-resistance minimizes power loss during operation, enhancing overall efficiency in switching applications.

Terminal Position: SINGLE

A single terminal position provides straightforward integration into designs, simplifying installation.

Technical Specifications

Power Field Effect Transistors (FET) STW25NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

21 A

Maximum Drain Current (ID):

21 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW25NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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