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STW24NM65N

STMicroelectronics

STW24NM65N by STMicroelectronics

STW24NM65N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 76A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,085 parts In-Stock

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7,085

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Digiode

USA . 1,492 parts In-Stock

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1,492

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Anansix

USA . 622 parts In-Stock

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622

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 943 parts In-Stock

1+ parts

$0.568

100+ parts

-

1k+ parts

$0.511

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943

$0.568

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$0.511

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MKK Technologies

India . 891 parts In-Stock

1+ parts

$1.067

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891

$1.067

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DigiPath Technology Company

USA . 891 parts In-Stock

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$1.067

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891

$1.067

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Component Stockers USA

USA . 5,230 parts In-Stock

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$2.320

100+ parts

$2.210

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$2.140

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5,230

$2.320

$2.210

$2.140

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AZTECH Wire

Italy . 1,215 parts In-Stock

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$9.550

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$9.550

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Perfect Parts

USA . 19,719 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,452 parts In-Stock

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7,452

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Alle Elektronik GmbH

Germany . 4,246 parts In-Stock

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Parana Technologies

USA . 1,572 parts In-Stock

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$0.679

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$0.679

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Corphita

USA . 1,239 parts In-Stock

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1,239

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Kepictronics

USA . 1,000 parts In-Stock

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Overview

Unlock superior performance with the STW24NM65N from STMicroelectronics—a powerhouse in power FET technology. Renowned for its reliability and innovation, STMicroelectronics ensures this N-channel transistor delivers exceptional efficiency in demanding applications like motor drives and industrial automation. Enjoy robust switching capabilities, enhanced durability, and a compact design that empowers your projects with unmatched value and performance. Experience the benefits of trusted quality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher efficiency and better performance in switching applications, enhancing overall operational reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration into circuits, simplifying design and improving performance in applications where reverse polarity might occur.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures minimal switching losses and faster response times.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage indicates robustness in high-voltage applications, making this FET suitable for industrial and power applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient stacking and layout design, optimizing space in electronic assemblies.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide greater mechanical stability and ease of soldering, ensuring reliable connections in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a high off-state resistance and lower conduction losses when the device is active.

Maximum Pulsed Drain Current (IDM): 76 A

This high pulsed current capability enables the FET to handle surges without damage, ideal for demanding applications.

Avalanche Energy Rating (EAS): 500 mJ

A substantial avalanche energy rating indicates that the transistor can tolerate transient fault conditions, enhancing reliability.

Maximum Drain Current (Abs): 19 A

The ability to support a maximum drain current of 19A makes this FET suitable for heavy loads in various applications.

No. of Terminals: 3

Three terminals provide straightforward connectivity while maintaining efficient control and operation within circuits.

Maximum Power Dissipation (Abs): 160 W

With a high power dissipation capacity, this FET is effective in managing heat, allowing for sustained operation under heavy loads.

Package Style (Meter): FLANGE MOUNT

Flange mount style contributes to better thermal management and stability in mounting, enhancing overall performance and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, making it ideal for battery-powered or efficient applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures implies versatility and reliability in extreme conditions, suitable for industrial environments.

Transistor Element Material: SILICON

Silicon is a widely used material for its efficient semiconductor properties, ensuring reliable performance in various electronic applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish ensures excellent solderability and corrosion resistance, enhancing the reliability of the device in long-term applications.

Maximum Drain Current (ID): 19 A

This repeated value reinforces the consistency of the FET’s specifications, ensuring reliability in maximum load applications.

Maximum Drain-Source On Resistance: 0.19 ohm

A low on-resistance contributes to reduced power losses and increased efficiency in circuit designs, making it a cost-effective choice.

Terminal Position: SINGLE

Single terminal position allows for simpler circuit designs and easier integration into narrow spaces or compact layouts.

Technical Specifications

Power Field Effect Transistors (FET) STW24NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

500 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW24NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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