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STW21NM60N

STMicroelectronics

STW21NM60N by STMicroelectronics

STW21NM60N by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and 68A pulsed drain current. It offers a low on-resistance of 0.22Ω and operates up to 150 °C. This versatile FET is suitable for high-power circuits.

Median Price

$9.828

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,080 parts In-Stock

1+ parts

$9.828

100+ parts

$4.258

1k+ parts

$4.029

10k+ parts

-

1,080

$9.828

$4.258

$4.029

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Vyrian

USA . 8,046 parts In-Stock

1+ parts

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8,046

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Digiode

USA . 4,497 parts In-Stock

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4,497

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Anansix

USA . 1,305 parts In-Stock

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1,305

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Lakeland Logistics Inc

USA . 1,080 parts In-Stock

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1,080

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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20

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,046 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

$0.320

10k+ parts

-

1,046

$0.356

-

$0.320

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MKK Technologies

India . 1,804 parts In-Stock

1+ parts

$0.670

100+ parts

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1,804

$0.670

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DigiPath Technology Company

USA . 1,804 parts In-Stock

1+ parts

$0.670

100+ parts

-

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1,804

$0.670

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AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$19.430

100+ parts

-

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50

$19.430

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Infinite Electronics LLP (Excess)

. 10,904 parts In-Stock

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RC Electronics

USA . 10,540 parts In-Stock

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Kepictronics

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,577 parts In-Stock

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5,577

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Corphita

USA . 3,327 parts In-Stock

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3,327

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,900 parts In-Stock

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1,900

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Parana Technologies

USA . 252 parts In-Stock

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$0.426

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252

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$0.426

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Overview

Elevate your designs with the STW21NM60N from STMicroelectronics—a top-tier N-channel power FET renowned for its reliability and performance. With a robust 600V breakdown voltage, this single transistor is ideal for efficient switching applications in power management systems. Enjoy peace of mind knowing you're backed by STMicroelectronics' industry-leading quality and innovation, providing you with unmatched durability and efficiency for superior electronic solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides robustness and durability, making this FET suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances protection against reverse voltage conditions, adding to reliability.

Transistor Application: SWITCHING

Designed for switching applications, this FET enables fast and efficient operation in power management systems.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows for the handling of high voltage applications, increasing versatility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient heat dissipation, contributing to improved thermal performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures stable mounting and connectivity, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and increases efficiency in active devices.

Maximum Pulsed Drain Current (IDM): 68 A

A high pulsed drain current capability enables the FET to handle significant current spikes, beneficial for transient applications.

Avalanche Energy Rating (EAS): 610 mJ

A high avalanche energy rating ensures that the FET can tolerate energy spikes, improving reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 17 A

With a high maximum drain current, this FET is capable of supporting substantial loads in various applications.

No. of Terminals: 3

Having 3 terminals simplifies circuit designs while ensuring adequate connectivity for various applications.

Maximum Power Dissipation (Abs): 140 W

High power dissipation capability allows this FET to handle substantial heat, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mounting options and enhances thermal conductivity, optimizing overall performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and efficient switching, making this FET effective for advanced applications.

Maximum Operating Temperature: 150 °C

A high operating temperature range enhances reliability in demanding environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon material is a standard choice for FETs, offering excellent electrical properties and stability.

Terminal Finish: TIN

Tin finish provides good conductivity and corrosion resistance, enhancing the longevity of the connections.

Maximum Drain Current (ID): 17 A

Consistent drain current rating emphasizes reliability and uniformity in performance across applications.

Maximum Drain-Source On Resistance: 0.22 ohm

Low on-resistance translates to minimized power loss, leading to increased efficiency in power switching operations.

Terminal Position: SINGLE

Single terminal position simplifies layout design and integration into existing circuits.

Technical Specifications

Power Field Effect Transistors (FET) STW21NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

610 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.22 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW21NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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