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STW20NM50

STMicroelectronics

STW20NM50 by STMicroelectronics

STW20NM50 by STMicroelectronics is a N-CHANNEL FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features 80A IDM, 650mJ EAS, and 0.25 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 214W at 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,517 parts In-Stock

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4,517

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Vyrian

USA . 3,969 parts In-Stock

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3,969

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Anansix

USA . 2,693 parts In-Stock

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2,693

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Magnum Semiconductors LLP

India . 1,500 parts In-Stock

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1,500

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R&J Components

USA . 247 parts In-Stock

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247

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Sunrise Surplus Inc.

USA . 200 parts In-Stock

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200

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ComSIT Distribution GmbH

Germany . 133 parts In-Stock

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IDEA Electronic Components Group

UK . 123 parts In-Stock

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$0.370

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$0.333

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123

$0.370

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$0.333

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MKK Technologies

India . 2,221 parts In-Stock

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$0.695

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$0.695

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DigiPath Technology Company

USA . 2,221 parts In-Stock

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$0.695

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$0.695

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AZTECH Wire

Italy . 531 parts In-Stock

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$20.220

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531

$20.220

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Ampacity Inc.

Singapore . 611 parts In-Stock

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$32.050

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611

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Kepictronics

USA . 10,000 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 6,231 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,808 parts In-Stock

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Corphita

USA . 1,679 parts In-Stock

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Infinite Electronics LLP (Excess)

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Parana Technologies

USA . 1,152 parts In-Stock

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$0.442

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RC Electronics

USA . 383 parts In-Stock

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Overview

Unlock the power of innovation with the STW20NM50 by STMicroelectronics. Crafted with precision and expertise, this N-CHANNEL Power FET offers unparalleled performance in switching applications. With a high DS Breakdown Voltage of 500V and a maximum Drain Current of 20A, this transistor is designed to meet your most demanding requirements. Whether you're in automotive, industrial, or consumer electronics, the STW20NM50 provides exceptional reliability and efficiency. Trust STMicroelectronics to deliver cutting-edge technology that drives your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and insulation, making the product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency, making this product a good choice for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse voltage spikes, enhancing the overall performance of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and efficient power handling capabilities.

Minimum DS Breakdown Voltage: 500 V

The high minimum breakdown voltage ensures that the FET can handle high voltage applications without risking damage or malfunction.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and integration into circuit boards, simplifying the assembly process.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection, making it easier to solder the FET onto a PCB.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage on the gate to turn on, which can prevent accidental activation and improve overall system safety.

Maximum Pulsed Drain Current (IDM): 80 A

The high maximum pulsed drain current allows the FET to handle sudden surge currents without damage, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 650 mJ

The high avalanche energy rating indicates the FET's ability to withstand high energy spikes, providing protection against voltage surges.

Maximum Drain Current (Abs) (ID): 20 A

With a maximum drain current of 20 A, this FET can handle moderate to high current loads, suitable for a wide range of power applications.

No. of Terminals: 3

Having 3 terminals allows for easy connection in a circuit, providing flexibility and compatibility with various circuit designs.

Maximum Power Dissipation (Abs): 214 W

The high maximum power dissipation rating ensures that the FET can handle high power levels without overheating or damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and stable mounting, making it suitable for applications where mechanical stability is important.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and reliability, making this FET a good choice for power applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high-temperature environments and operate reliably under various conditions.

Transistor Element Material: SILICON

Silicon material for the transistor element offers high performance and reliability, making this FET a durable and efficient choice for power applications.

Terminal Finish: Matte Tin (Sn)

Matte tin finish on the terminals provides corrosion resistance and ensures a secure connection, enhancing the overall reliability of the product.

Maximum Drain-Source On Resistance: 0.25 ohm

The low maximum drain-source on resistance of 0.25 ohm reduces power loss and improves efficiency, making this FET suitable for high-current applications.

Terminal Position: SINGLE

Single terminal position simplifies wiring and connection, making it easier to integrate the FET into a circuit.

Technical Specifications

Power Field Effect Transistors (FET) STW20NM50 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

650 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

80 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW20NM50 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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