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STV0196B

STMicroelectronics

STV0196B by STMicroelectronics

STV0196B by STMicroelectronics is a consumer IC designed for surface mount applications. It features a 64-terminal flatpack design, operates b/w -10 °C to 85°C, and supports supply voltages from 3V to 3.6V. Ideal for various consumer electronics, it ensures reliable performance with nickel palladium gold terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,744 parts In-Stock

1+ parts

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2,744

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Anansix

USA . 680 parts In-Stock

1+ parts

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680

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Digiode

USA . 628 parts In-Stock

1+ parts

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628

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,191 parts In-Stock

1+ parts

$0.717

100+ parts

-

1k+ parts

$0.645

10k+ parts

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1,191

$0.717

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$0.645

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MKK Technologies

India . 574 parts In-Stock

1+ parts

$1.348

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574

$1.348

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DigiPath Technology Company

USA . 574 parts In-Stock

1+ parts

$1.348

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574

$1.348

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Authorized Procurement Solutions

USA . 312,000 parts In-Stock

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312,000

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A-Z Elektronik GmbH

Germany . 5,747 parts In-Stock

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5,747

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Corphita

USA . 1,003 parts In-Stock

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1,003

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 907 parts In-Stock

1+ parts

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100+ parts

$0.857

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907

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$0.857

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Metaverse IC Inc.

Canada . 700 parts In-Stock

1+ parts

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700

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GreenTree Electronics

Israel . 504 parts In-Stock

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504

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Kepictronics

USA . 176 parts In-Stock

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176

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Overview

Unlock a world of innovation with the STV0196B from STMicroelectronics! This premium consumer IC delivers exceptional performance and reliability, ensuring your devices operate seamlessly. Crafted with precision in a robust package, it thrives in various applications, from audio systems to smart home devices. Trust in STMicroelectronics’ commitment to quality and benefit from enhanced efficiency and durability that elevates your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, enhancing the reliability of the IC.

Surface Mount: YES

Surface mount technology allows for efficient PCB space utilization and simplifies the manufacturing process.

Package Shape: SQUARE

The square shape facilitates easy placement and alignment on printed circuit boards, optimizing layout options.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring compatibility and performance in everyday devices.

No. of Terminals: 64

A higher number of terminals allows for more input/output options, making the IC versatile for various applications.

Package Style (Meter): FLATPACK

The flatpack style is ideal for applications requiring low-profile designs, saving space in compact devices.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures ensures reliability in warmer environments, extending the product's life.

Minimum Operating Temperature: -10 °C

This wide operating temperature range enables use in diverse environments, expanding application possibilities.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium finish offers excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal positioning provides flexibility in circuit design and allows for efficient routing on PCBs.

Maximum Seated Height: 3.4 mm

A low seated height is advantageous for maintaining a slim profile in compact device designs.

Width: 14 mm

The compact width of 14 mm contributes to space-saving designs in consumer electronics.

Minimum Supply Voltage (Vsup): 3 V

Allows for operation with lower voltage supplies, enhancing energy efficiency and broadening compatibility with battery-operated devices.

Length: 14 mm

A balanced length of 14 mm provides a compact footprint without compromising functionality.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering, improving manufacturing efficiency and reducing assembly errors.

Maximum Supply Current: 480 mA

This high current capability allows for supporting demanding applications that require more power, enhancing performance.

Terminal Pitch: 0.8 mm

A fine terminal pitch enables tighter packing of components on PCBs, saving space and increasing design flexibility.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V ensures compatibility with a wide range of power sources while maintaining safe operation.

Technical Specifications

Other Function Consumer ICs STV0196B attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3.4 mm

Maximum Supply Current:

480 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

STV0196B General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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