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STV0684

STMicroelectronics

STV0684 by STMicroelectronics

STV0684 by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates within a voltage range of 1.65-1.95V and features 196 terminals in a compact 12mm x 12mm package. With a max temp of 70 °C, it's ideal for various consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,550 parts In-Stock

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5,550

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Digiode

USA . 1,593 parts In-Stock

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1,593

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Anansix

USA . 644 parts In-Stock

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644

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,073 parts In-Stock

1+ parts

$1.026

100+ parts

-

1k+ parts

$0.923

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2,073

$1.026

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$0.923

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MKK Technologies

India . 828 parts In-Stock

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$1.929

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828

$1.929

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DigiPath Technology Company

USA . 828 parts In-Stock

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$1.929

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828

$1.929

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AZTECH Wire

Italy . 978 parts In-Stock

1+ parts

$13.870

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978

$13.870

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Component Stockers USA

USA . 693 parts In-Stock

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$99.990

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693

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 4,866 parts In-Stock

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Corphita

USA . 4,444 parts In-Stock

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4,444

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Microchip USA

USA . 4,426 parts In-Stock

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4,426

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Parana Technologies

USA . 2,117 parts In-Stock

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$1.226

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2,117

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$1.226

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 18 parts In-Stock

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Overview

Unlock the potential of your applications with the STV0684 from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers unparalleled quality and innovation in consumer ICs. This compact, low-profile marvel enhances performance across diverse uses—from smartphones to smart home devices—ensuring reliability and efficiency. Experience seamless integration, lower power consumption, and superior functionality, making your projects stand out with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability while keeping the weight of the product low.

Surface Mount: YES

Surface mount design allows for compact PCB layouts, making it suitable for space-constrained applications.

Package Shape: SQUARE

The square package shape provides uniform thermal dissipation and efficient use of PCB space.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring optimal performance in everyday devices.

Power Supplies (V): 1.8, 3.3

Supports dual power supply options, making it versatile for various electronic designs.

No. of Terminals: 196

A high number of terminals allows for complex functionalities in a single IC, enabling advanced circuit designs.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile fine pitch package style is ideal for high-density applications, ensuring ease of assembly and minimizing footprint.

Maximum Operating Temperature: 70 °C

The maximum operating temperature makes this IC suitable for commercial applications that experience moderate heat.

Minimum Operating Temperature: 0 °C

Operational from 0 °C allows the IC to function effectively in standard environments, increasing its usability in various products.

Terminal Position: BOTTOM

Bottom terminal position facilitates better soldering and heat dissipation during operation.

Maximum Seated Height: 1.7 mm

A low seated height enhances compatibility with compact designs and helps in maintaining a low profile for devices.

Width: 12 mm

The 12 mm width provides a balanced design for integration into numerous applications without compromising performance.

Minimum Supply Voltage (Vsup): 1.65 V

Allows for operation at low voltage, contributing to power efficiency in battery-powered devices.

Length: 12 mm

A uniform length of 12 mm ensures symmetry in design, improving layout and efficiency on a PCB.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for a wide range of consumer applications without specialized cooling.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an excellent choice for modern electronics.

Terminal Form: BALL

Ball terminals allow for reliable connections with high-density interconnections that are critical in modern devices.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch enables a compact design, making it ideal for densely packed electronic boards.

Maximum Supply Voltage (Vsup): 1.95 V

Supports a relatively low maximum supply voltage, contributing to energy efficiency and compatibility with various power systems.

Technical Specifications

Other Function Consumer ICs STV0684 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO REQUIRES 3V TO 3.6V SUPPLY

General IC Type:

JESD-30 Code:

S-PBGA-B196

Length:

12 mm

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

STV0684 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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