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STV0056A

STMicroelectronics

STV0056A by STMicroelectronics

STV0056A by STMicroelectronics is a consumer IC designed for applications requiring dual terminals and BICMOS technology. It operates at 5-12V with a max temp of 70 °C, housed in a rectangular plastic/epoxy package. Ideal for various consumer circuit uses.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 2,438 parts In-Stock

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Anansix

USA . 1,326 parts In-Stock

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A&K Electronics

USA . 1,003 parts In-Stock

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Bristol Electronics

USA . 1,003 parts In-Stock

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Digiode

USA . 172 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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GES GmbH

Germany . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 441 parts In-Stock

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$2.156

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$1.940

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441

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$1.940

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MKK Technologies

India . 996 parts In-Stock

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$4.053

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$4.053

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DigiPath Technology Company

USA . 996 parts In-Stock

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$4.053

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Authorized Procurement Solutions

USA . 45,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,407 parts In-Stock

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RC Electronics

USA . 2,596 parts In-Stock

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Corphita

USA . 1,651 parts In-Stock

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Assy Fe

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Parana Technologies

USA . 686 parts In-Stock

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Perfect Parts

USA . 525 parts In-Stock

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525

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GreenTree Electronics

Israel . 469 parts In-Stock

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Overview

Elevate your projects with the STV0056A from STMicroelectronics, a trusted leader in cutting-edge technology. This versatile consumer IC combines exceptional performance with reliability, making it an ideal choice for various applications from home automation to consumer electronics. Its robust design ensures seamless integration and efficiency, delivering unmatched value to your designs. Choose STMicroelectronics for innovative solutions that enhance your product's success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials enhances reliability and protects the IC from environmental factors, making it suitable for various consumer applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient space utilization on PCBs, facilitating easy integration into various consumer electronic designs.

General IC Type: CONSUMER CIRCUIT

Being a consumer circuit IC, this product is optimized for everyday electronic applications, ensuring compatibility and performance in consumer devices.

Power Supplies (V): 5,12

The dual voltage power supply capability (5V and 12V) provides versatility for various applications, allowing the IC to operate in different consumer products with ease.

No. of Terminals: 56

A high terminal count of 56 increases the IC's functionality and ability to connect to multiple components, catering to complex consumer device requirements.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch style enables efficient space-saving designs, making it ideal for compact consumer electronics without compromising performance.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures stable performance in various environments, contributing to the reliability and longevity of the product.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows the IC to function effectively in lower temperature conditions, increasing its versatility across diverse usage scenarios.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and soldering processes, reducing assembly time and costs for manufacturers.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, this IC is suitable for low-profile designs, helping maintain a compact form factor in consumer products.

Width: 15.24 mm

The width of 15.24 mm strikes a balance between compactness and functionality, making it ideal for a variety of consumer electronics.

Length: 52.12 mm

A length of 52.12 mm provides ample space for terminal connections while fitting comfortably within standard PCB dimensions used in consumer devices.

Temperature Grade: COMMERCIAL

As a commercial-grade component, it is designed for reliable performance in everyday consumer applications that require stable functionality.

Technology: BICMOS

Utilizing BICMOS technology offers benefits of both bipolar and CMOS technologies, enhancing performance while minimizing power consumption.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical and electrical connections, making them ideal for applications requiring high reliability and durability.

Terminal Pitch: 1.778 mm

The 1.778 mm terminal pitch accommodates standard PCB layouts and facilitates easier routing, ensuring optimal performance in consumer applications.

Technical Specifications

Other Function Consumer ICs STV0056A attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T56

JESD-609 Code:

e0

Length:

52.12 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP56,.7

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

STV0056A General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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