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STV0674T064

STMicroelectronics

STV0674T064 by STMicroelectronics

STV0674T064 by STMicroelectronics is a low-profile consumer IC designed for surface mount applications. It operates b/w 1.55V and 1.95V, features a quad terminal layout with a 0.5mm pitch, and withstands temperatures from 0 °C to 70 °C. Ideal for compact electronic devices, it ensures reliable performance in various consumer applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,149 parts In-Stock

1+ parts

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4,149

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Digiode

USA . 994 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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994

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Anansix

USA . 355 parts In-Stock

1+ parts

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100+ parts

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355

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

$0.349

10k+ parts

-

379

$0.388

-

$0.349

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MKK Technologies

India . 269 parts In-Stock

1+ parts

$0.730

100+ parts

-

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269

$0.730

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DigiPath Technology Company

USA . 269 parts In-Stock

1+ parts

$0.730

100+ parts

-

1k+ parts

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269

$0.730

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-

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Corphita

USA . 3,858 parts In-Stock

1+ parts

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3,858

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Parana Technologies

USA . 26 parts In-Stock

1+ parts

-

100+ parts

$0.464

1k+ parts

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26

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$0.464

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Overview

Elevate your designs with the STV0674T064 from STMicroelectronics, a leader in semiconductor innovation. This versatile consumer IC combines superior performance and reliability, ensuring seamless integration into various applications from IoT devices to advanced consumer electronics. With its low-profile design and robust thermal characteristics, this circuit enhances operational efficiency, making it a smart choice for engineers looking to maximize value and minimize costs. Trust STMicroelectronics for quality that empowers your next breakthrough!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for consumer electronics.

Surface Mount: YES

Surface mount capability allows for efficient manufacturing processes and saves board space, which is advantageous for compact designs.

Package Shape: SQUARE

The square shape aids in uniform thermal distribution and integration into various circuit layouts.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring optimal performance in electronic devices like smartphones and appliances.

Power Supplies (V): 1.8, 3.3

Supports a range of supply voltages, making it versatile for different applications and improving energy efficiency.

No. of Terminals: 64

A higher number of terminals provides greater connectivity options, enhancing the functionality of the IC.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile and fine pitch design facilitate high-density circuit layouts, ideal for modern compact devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability and performance stability in warm environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows the IC to function effectively in varying climates, enhancing its versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, improving long-term performance.

Terminal Position: QUAD

Quad terminal arrangement offers flexible layout options for PCB design, simplifying assembly and reducing manufacturing costs.

Maximum Seated Height: 1.6 mm

The low seated height allows for integration into slim devices, meeting demands for modern aesthetics and portability.

Width: 10 mm

A compact width facilitates space-efficient designs, making it a perfect fit for a variety of electronic applications.

Minimum Supply Voltage (Vsup): 1.55 V

Low minimum supply voltage supports energy-efficient operation, aligning with modern energy consumption standards.

Length: 10 mm

A modest length complements the compact design, suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

Commercial grade indicates a suitable operating range for consumer products, ensuring reliability across typical usage environments.

Technology: CMOS

CMOS technology enables low power consumption and high-speed operation, which are critical for consumer electronic applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes and improve mechanical stability on PCBs, enhancing manufacturing and reliability.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for more connections in a smaller area, essential for modern compact circuit design.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage enhances compatibility with various power sources while maintaining safe operating conditions.

Technical Specifications

Other Function Consumer ICs STV0674T064 attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.55 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STV0674T064 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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