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STV0900AAC

STMicroelectronics

STV0900AAC by STMicroelectronics

STV0900AAC by STMicroelectronics is a dual-function consumer IC in a low-profile flatpack package. It features 128 terminals and utilizes CMOS technology for efficient performance. Ideal for applications requiring compact design and reliable operation in consumer electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,688 parts In-Stock

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3,688

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Digiode

USA . 902 parts In-Stock

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902

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Bristol Electronics

USA . 773 parts In-Stock

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773

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Anansix

USA . 390 parts In-Stock

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390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 230 parts In-Stock

1+ parts

$0.512

100+ parts

-

1k+ parts

$0.460

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230

$0.512

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$0.460

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MKK Technologies

India . 814 parts In-Stock

1+ parts

$0.962

100+ parts

-

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814

$0.962

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DigiPath Technology Company

USA . 814 parts In-Stock

1+ parts

$0.962

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814

$0.962

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Microchip USA

USA . 5,284 parts In-Stock

1+ parts

$23.520

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5,284

$23.520

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Corphita

USA . 4,370 parts In-Stock

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4,370

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Parana Technologies

USA . 1,613 parts In-Stock

1+ parts

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$0.612

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1,613

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$0.612

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock a world of high-performance audio and video solutions with the STV0900AAC from STMicroelectronics. Renowned for their innovation, STMicroelectronics delivers cutting-edge consumer ICs that transform everyday experiences into extraordinary moments. This versatile component enhances connectivity in diverse applications, ensuring stellar performance while maintaining a compact design. Elevate your projects with unmatched quality and reliability—where technology meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making the product suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for compact designs and facilitates automated assembly, which can significantly reduce manufacturing costs.

No. of Functions: 2

Having two functions integrated into a single IC enhances versatility, allowing for more efficient circuit designs and savings on board space.

Package Shape: SQUARE

The square package shape provides ease of placement and soldering, contributing to the reliability of the final product in electronics.

General IC Type: CONSUMER CIRCUIT

As a consumer circuit IC, this product is tailored for high-volume consumer electronics, ensuring affordability and high performance in everyday applications.

No. of Terminals: 128

With 128 terminals, this IC can handle complex connections and functionalities, making it ideal for sophisticated consumer devices.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE

The flatpack low-profile design allows for better space management in devices, while supportive heat sink features aid in thermal management, enhancing reliability.

Terminal Position: QUAD

The quad terminal position allows for efficient layout designs and signal integrity, making it easier to integrate into a variety of circuit configurations.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and higher performance, which is critical for battery-operated consumer devices.

Terminal Form: FLAT

Flat terminal form contributes to optimal surface contact during soldering, leading to reliable electrical connections and improved overall product durability.

Technical Specifications

Other Function Consumer ICs STV0900AAC attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

Additional Features:

1.0 V CORE NOMINAL SUPPLY AVAILABLE

General IC Type:

JESD-30 Code:

S-PQFP-N128

No. of Functions:

2

No. of Terminals:

128

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128(UNSPEC)

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

STV0900AAC General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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