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STU8NM50N

STMicroelectronics

STU8NM50N by STMicroelectronics

STU8NM50N by STMicroelectronics is a N-CHANNEL FET with 500V DS breakdown voltage, 20A IDM, and 0.79 ohm RDS(on). Ideal for switching applications, it has a max power dissipation of 45W and operates in enhancement mode at up to 150 °C.

Median Price

$1.190

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,896 parts In-Stock

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$0.676

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$0.676

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Chip1Stop

Japan . 2,896 parts In-Stock

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$1.190

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2,896

$1.190

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DigiKey

USA . 1,814 parts In-Stock

1+ parts

$2.550

100+ parts

$1.176

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$0.899

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$0.829

1,814

$2.550

$1.176

$0.899

$0.829

Verical

USA . 2,896 parts In-Stock

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2,896

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Digiode

USA . 1,679 parts In-Stock

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$0.635

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1,679

$0.635

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Vyrian

USA . 3,571 parts In-Stock

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$0.668

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3,571

$0.668

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ACDS - Activité Composants Distribution Service

France . 3,005 parts In-Stock

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Bristol Electronics

USA . 150 parts In-Stock

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150

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Anansix

USA . 128 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

1+ parts

$0.295

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$0.266

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1,928

$0.295

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$0.266

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MKK Technologies

India . 1,034 parts In-Stock

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$0.555

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1,034

$0.555

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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$0.555

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$0.555

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Corphita

USA . 3,272 parts In-Stock

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$0.601

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$0.601

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$2.070

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$1.884

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$1.697

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40

$2.070

$1.884

$1.697

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Microchip USA

USA . 4,293 parts In-Stock

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$11.245

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Perfect Parts

USA . 6,048 parts In-Stock

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Kepictronics

USA . 5,631 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3,005 parts In-Stock

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GreenTree Electronics

Israel . 2,700 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,814 parts In-Stock

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Parana Technologies

USA . 182 parts In-Stock

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$0.353

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$0.353

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Overview

Experience the exceptional quality and reliability of STMicroelectronics with the STU8NM50N Power Field Effect Transistor. This N-Channel FET offers superior performance in switching applications, providing customers with efficiency and durability. With a high breakdown voltage of 500V and a maximum power dissipation of 45W, this transistor is ideal for a range of industrial and automotive applications. Trust STMicroelectronics for cutting-edge technology and unmatched value in electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides insulation and protection for the FET, ensuring reliable performance and durability.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs have lower on-resistance and higher current carrying capacity compared to P-Channel FETs, making them a suitable choice for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for the protection of the FET from voltage spikes and reverse currents, enhancing the reliability of the overall circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Minimum DS Breakdown Voltage: 500 V

High breakdown voltage allows for operation in high voltage environments, increasing the versatility of the product.

Maximum Pulsed Drain Current (IDM): 20 A

Capable of handling high current pulses, making it suitable for applications that require peak power handling.

Maximum Power Dissipation (Abs): 45 W

Can dissipate a significant amount of power without overheating, ensuring stable operation under heavy loads.

Maximum Operating Temperature: 150 °C

Operates effectively at high temperatures, making it suitable for industrial and automotive applications where temperature fluctuations are common.

Technical Specifications

Power Field Effect Transistors (FET) STU8NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.79 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU8NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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