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STU8NC90ZI

STMicroelectronics

STU8NC90ZI by STMicroelectronics

STU8NC90ZI from STMicroelectronics is an N-channel FET designed for switching applications. It features a 900V breakdown voltage, 28A max pulsed drain current, and operates at up to 150 °C. Ideal for high-power circuits with efficient thermal management.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,664 parts In-Stock

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3,664

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Digiode

USA . 2,531 parts In-Stock

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2,531

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Anansix

USA . 2,316 parts In-Stock

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2,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,301 parts In-Stock

1+ parts

$1.738

100+ parts

-

1k+ parts

$1.564

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1,301

$1.738

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$1.564

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MKK Technologies

India . 806 parts In-Stock

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$3.268

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806

$3.268

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DigiPath Technology Company

USA . 806 parts In-Stock

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$3.268

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806

$3.268

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Parana Technologies

USA . 1,933 parts In-Stock

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$2.078

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1,933

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$2.078

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Corphita

USA . 1,830 parts In-Stock

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Overview

Elevate your power management solutions with the STU8NC90ZI from STMicroelectronics—where quality meets innovation. Crafted by a trusted leader in semiconductor technology, this N-channel Power FET ensures reliable switching performance in demanding applications. With its robust design and enhanced capabilities, it delivers exceptional efficiency and durability, making it perfect for industrial controls, automotive systems, and renewable energy. Experience unparalleled value and reliability that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight packaging and good thermal performance, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have higher electron mobility, allowing for better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional safety and protection against voltage spikes, enhancing reliability in circuit designs.

Transistor Application: SWITCHING

Designed for switching applications, this FET is optimized for fast switching speeds, making it suitable for power management circuits.

Minimum DS Breakdown Voltage: 900 V

A high breakdown voltage allows this transistor to handle high-voltage applications, increasing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and integration into various electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide reliable mechanical support and ease of soldering for robust connections in circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption in standby modes, improving overall energy efficiency in applications.

Maximum Pulsed Drain Current (IDM): 28 A

The ability to handle high pulsed currents makes this FET suitable for applications with sudden load changes.

Avalanche Energy Rating (EAS): 430 mJ

A high avalanche energy rating indicates robustness against transient events, enhancing durability in harsh conditions.

Maximum Drain Current (Abs) (ID): 7 A

This specification indicates the safe maximum current the transistor can handle continuously, ensuring circuit protection.

No. of Terminals: 3

The three-terminal design simplifies integration into circuits while providing the necessary connections for functionality.

Maximum Power Dissipation (Abs): 55 W

With high power dissipation capability, this FET can effectively manage heat in demanding applications, enhancing reliability.

Package Style (Meter): IN-LINE

The in-line package style allows for easy assembly and compatibility with standard PCB layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low gate drive power, which is advantageous for digital and analog applications.

Maximum Operating Temperature: 150 °C

The high operating temperature limits make this FET suitable for high-temperature environments, increasing its range of applications.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and scalability in various electronic devices.

Terminal Finish: TIN LEAD

Tin-lead finish provides excellent solderability and corrosion resistance, ensuring long-lasting connections.

Maximum Drain Current (ID): 7 A

Consistent maximum drain current capability ensures reliability for applications requiring sustained current flow.

Maximum Drain-Source On Resistance: 1.38 ohm

Low on-resistance translates to lower energy losses during operation, enhancing overall system efficiency.

Terminal Position: SINGLE

Single terminal positioning simplifies layout and design considerations on PCBs, optimizing space utilization.

Case Connection: ISOLATED

Isolated case connections ensure safety and prevent unintended current paths, making it a reliable choice for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STU8NC90ZI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

430 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

1.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU8NC90ZI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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