Loading...

STU8N65M5

STMicroelectronics

STU8N65M5 by STMicroelectronics

STU8N65M5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 650V breakdown voltage, 28A pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,362

-

-

-

-

Digiode

USA . 4,850 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,850

-

-

-

-

Flip Electronics

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

Anansix

USA . 108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

108

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 697 parts In-Stock

1+ parts

$0.376

100+ parts

-

1k+ parts

$0.339

10k+ parts

-

697

$0.376

-

$0.339

-

MKK Technologies

India . 1,736 parts In-Stock

1+ parts

$0.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,736

$0.708

-

-

-

DigiPath Technology Company

USA . 1,736 parts In-Stock

1+ parts

$0.708

100+ parts

-

1k+ parts

-

10k+ parts

-

1,736

$0.708

-

-

-

Advanced Electronics

New Zealand . 63 parts In-Stock

1+ parts

$2.313

100+ parts

$2.105

1k+ parts

$1.897

10k+ parts

-

63

$2.313

$2.105

$1.897

-

AZTECH Wire

Italy . 369 parts In-Stock

1+ parts

$16.510

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$16.510

-

-

-

Component Stockers USA

USA . 592 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

592

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,940

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Alle Elektronik GmbH

Germany . 4,291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,291

-

-

-

-

Perfect Parts

USA . 3,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,550

-

-

-

-

Corphita

USA . 3,230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,230

-

-

-

-

Parana Technologies

USA . 632 parts In-Stock

1+ parts

-

100+ parts

$0.450

1k+ parts

-

10k+ parts

-

632

-

$0.450

-

-

Authorized Procurement Solutions

USA . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

GreenTree Electronics

Israel . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Unlock exceptional performance with the STU8N65M5 power FET from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for optimal switching efficiency, this N-channel transistor ensures reliability across various applications, from industrial controls to energy management. With superior breakdown voltage and advanced thermal capabilities, it delivers unmatched durability and value, empowering your designs to thrive in demanding environments while enhancing overall system efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making this FET well-suited for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency, making this FET a great choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances reliability, particularly in applications involving inductive loads.

Transistor Application: SWITCHING

Designed primarily for switching applications, this FET can efficiently manage current flow, making it ideal for power management solutions.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage of 650 V allows this FET to handle high-voltage applications, enhancing safety and performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout flexibility and makes it easier to integrate into various circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and excellent electrical connections, making this FET reliable for use in diverse applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption during standby, increasing overall efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 28 A

The capability of handling a pulsed drain current of 28 A enables this FET to deal with transient conditions effectively, ideal for dynamic applications.

Avalanche Energy Rating (EAS): 120 mJ

An avalanche energy rating of 120 mJ ensures that the FET can withstand transient voltage spikes without damage, enhancing durability and reliability.

Maximum Drain Current (Abs) (ID): 7 A

Abs max drain current rating of 7 A makes this FET suitable for various power applications while ensuring it doesn't overheat or fail under load.

No. of Terminals: 3

The 3-terminal design simplifies the connection and integration process in electronic circuits, offering versatility in application.

Maximum Power Dissipation (Abs): 70 W

The ability to dissipate up to 70 W of power ensures the FET can handle substantial loads without overheating, suitable for high-power applications.

Package Style (Meter): IN-LINE

An in-line package style supports straightforward installation in PCB layouts, providing ease of use and effective thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology allows for faster switching speeds and higher efficiencies, making this FET ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating of 150 °C enables this FET to function reliably in hot environments, increasing its application scope.

Transistor Element Material: SILICON

Silicon as an element material enhances thermal stability and electrical performance, contributing to overall reliability in power applications.

Maximum Drain Current (ID): 7 A

Reiterating the maximum drain current rating of 7 A emphasizes the FET's capacity to manage moderate loads effectively.

Maximum Drain-Source On Resistance: 0.6 ohm

A low on-resistance of 0.6 ohm minimizes energy loss during operation, improving overall efficiency in power delivery applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit designs, facilitating easier integration into a variety of electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STU8N65M5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

120 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STU8N65M5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 9