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STS4DNFS30

STMicroelectronics

STS4DNFS30 by STMicroelectronics

STS4DNFS30 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 4.5 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in electronic devices.

Median Price

$2.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,495 parts In-Stock

1+ parts

$2.270

100+ parts

$0.990

1k+ parts

$0.727

10k+ parts

$0.625

1,495

$2.270

$0.990

$0.727

$0.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,664 parts In-Stock

1+ parts

$2.156

100+ parts

-

1k+ parts

-

10k+ parts

-

4,664

$2.156

-

-

-

Vyrian

USA . 3,931 parts In-Stock

1+ parts

$2.270

100+ parts

-

1k+ parts

-

10k+ parts

-

3,931

$2.270

-

-

-

A2Z Electronics, Inc.

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,500

-

-

-

-

Anansix

USA . 654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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654

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 322 parts In-Stock

1+ parts

$0.849

100+ parts

-

1k+ parts

$0.764

10k+ parts

-

322

$0.849

-

$0.764

-

MKK Technologies

India . 586 parts In-Stock

1+ parts

$1.597

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$1.597

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-

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DigiPath Technology Company

USA . 586 parts In-Stock

1+ parts

$1.597

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$1.597

-

-

-

Corphita

USA . 90 parts In-Stock

1+ parts

$2.043

100+ parts

-

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10k+ parts

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90

$2.043

-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

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5,000

-

-

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Perfect Parts

USA . 3,898 parts In-Stock

1+ parts

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3,898

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-

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Parana Technologies

USA . 2,214 parts In-Stock

1+ parts

-

100+ parts

$1.015

1k+ parts

-

10k+ parts

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2,214

-

$1.015

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Alle Elektronik GmbH

Germany . 1,517 parts In-Stock

1+ parts

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100+ parts

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1,517

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Microchip USA

USA . 248 parts In-Stock

1+ parts

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248

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Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

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100+ parts

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200

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Overview

Unlock the power of innovation with the STS4DNFS30 from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This versatile N-channel power FET delivers exceptional efficiency and reliability for your switching applications, ensuring optimal performance even in demanding environments. With its compact design and built-in diode, it seamlessly integrates into your projects, providing enhanced thermal management and durability. Elevate your designs and experience unmatched value with STMicroelectronics today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental conditions, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and higher electron mobility, making them suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies design and protects the circuit, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET enables fast and efficient operation in various circuits.

Surface Mount: YES

Surface mount technology ensures compact design and improved thermal performance, making it ideal for space-constrained applications.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures reliable operation in circuits subject to high voltage spikes.

Package Shape: RECTANGULAR

The rectangular shape optimizes space for PCB layout, facilitating easy integration into a variety of designs.

Terminal Form: GULL WING

Gull wing terminals provide improved solder joint reliability and easier mounting on PCB, ensuring robust connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for a normally-off state, leading to power savings when the device is not in use.

Maximum Pulsed Drain Current (IDM): 13 A

A high pulsed drain current capability allows for handling large transients without damaging the device, beneficial in dynamic applications.

Maximum Drain Current (Abs) (ID): 4.5 A

The maximum drain current rating supports adequate load handling for a variety of applications while maintaining device integrity.

No. of Terminals: 8

With 8 terminals, the device supports versatile connection configurations, enhancing its applicability in complex circuits.

Maximum Power Dissipation (Abs): 2 W

A maximum power dissipation rating of 2 W helps in managing heat effectively, ensuring stable performance under load.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables higher density PCB designs, making it ideal for modern electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers low gate drive power requirements, which increases energy efficiency in applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C enhances reliability in high-temperature environments, suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon provides excellent electronic properties and is the primary material used in semiconductor devices, ensuring performance consistency.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent corrosion resistance and enhanced solderability, improving connection longevity.

Maximum Drain Current (ID): 4.5 A

The reiterated maximum drain current ensures consistency in device specifications, making it easier for designers to integrate.

Maximum Drain-Source On Resistance: 0.085 ohm

Low on-resistance minimizes power loss during operation, thereby increasing overall efficiency in electronic applications.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in circuit design, allowing for versatile integration into various layouts.

Technical Specifications

Power Field Effect Transistors (FET) STS4DNFS30 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

13 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS4DNFS30 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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