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STS4PF20V

STMicroelectronics

STS4PF20V by STMicroelectronics

STS4PF20V by STMicroelectronics is a P-channel MOSFET designed for efficient switching applications. It features a max drain current of 4 A, a breakdown voltage of 20 V, and operates at up to 150 °C. Its compact SO8 package ensures easy surface mounting in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,936 parts In-Stock

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Vyrian

USA . 1,839 parts In-Stock

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Anansix

USA . 455 parts In-Stock

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455

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Extreme Components

USA . 247 parts In-Stock

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247

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IDEA Electronic Components Group

UK . 665 parts In-Stock

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$0.518

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$0.466

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665

$0.518

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$0.466

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MKK Technologies

India . 1,313 parts In-Stock

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$0.974

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DigiPath Technology Company

USA . 1,313 parts In-Stock

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$0.974

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1,313

$0.974

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Assy Fe

Spain . 4,180 parts In-Stock

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Parana Technologies

USA . 1,987 parts In-Stock

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$0.619

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$0.619

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Kepictronics

USA . 1,680 parts In-Stock

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1,680

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Corphita

USA . 1,530 parts In-Stock

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Overview

Elevate your designs with the STS4PF20V P-Channel FET from STMicroelectronics, a leader in innovation and quality. This compact power transistor delivers reliable performance in demanding applications such as switching and signal modulation. With a robust construction and built-in diode, it ensures efficiency and durability, making it ideal for everything from consumer electronics to industrial systems. Experience the advantage of superior power management and exceptional thermal stability that enhances your projects' reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package enhances durability, providing protection against environmental factors.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are typically easier to drive with integrated circuits, making them convenient for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in a single configuration simplifies circuit design and reduces component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation in digital circuits.

Surface Mount: YES

Surface mount compatibility allows for compact designs and easier manufacturing processes.

Minimum DS Breakdown Voltage: 20 V

A minimum breakdown voltage of 20V safeguards against voltage spikes, increasing reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs and enhances thermal performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and placement on circuit boards, enhancing manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides improved efficient switching characteristics and minimizes power loss during operation.

Maximum Pulsed Drain Current (IDM): 16 A

Capability to handle pulsed currents up to 16A ensures the FET can manage demanding applications without failure.

Maximum Drain Current (Abs) (ID): 4 A

4A maximum drain current makes this FET suitable for a wide range of applications, offering reliable performance.

No. of Terminals: 8

The 8-terminal configuration allows for multiple connections in designs, providing flexibility in usage.

Maximum Power Dissipation (Abs): 2.5 W

2.5W power dissipation capability ensures the FET can operate without overheating in typical applications.

Package Style (Meter): SMALL OUTLINE

A small outline package allows for high-density designs, making it suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology typically offers higher input impedance and faster switching speeds compared to other types.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can be used in demanding environments without compromising performance.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal stability and high performance in electronic applications.

Maximum Drain Current (ID): 4 A

Repeated mention reinforces the capability to handle various loads, making it versatile for multiple circuits.

Maximum Drain-Source On Resistance: 0.135 ohm

0.135 ohm on-resistance ensures low power loss during operation, translating to better efficiency in power management.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on circuit boards, ensuring ease of integration.

Technical Specifications

Power Field Effect Transistors (FET) STS4PF20V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.135 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS4PF20V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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