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STS4DPF30L

STMicroelectronics

STS4DPF30L by STMicroelectronics

STS4DPF30L by STMicroelectronics is a P-channel FET designed for efficient switching applications. It features a max drain current of 4 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Its compact SO package ensures easy surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,485 parts In-Stock

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3,485

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Vyrian

USA . 3,219 parts In-Stock

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3,219

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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2,500

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Semi Source

USA . 2,400 parts In-Stock

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2,400

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Pegasus Components GmbH

Germany . 1,780 parts In-Stock

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1,780

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Florida Circuit

USA . 1,537 parts In-Stock

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1,537

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Anansix

USA . 1,168 parts In-Stock

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1,168

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ComSIT Distribution GmbH

Germany . 611 parts In-Stock

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611

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J2 Sourcing AB

Sweden . 470 parts In-Stock

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470

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Prism Electronics

USA . 45 parts In-Stock

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45

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 937 parts In-Stock

1+ parts

$0.692

100+ parts

-

1k+ parts

$0.623

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937

$0.692

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$0.623

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MKK Technologies

India . 238 parts In-Stock

1+ parts

$1.301

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238

$1.301

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DigiPath Technology Company

USA . 238 parts In-Stock

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$1.301

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238

$1.301

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AZTECH Wire

Italy . 695 parts In-Stock

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$16.830

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695

$16.830

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Kepictronics

USA . 8,002 parts In-Stock

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8,002

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Perfect Parts

USA . 2,850 parts In-Stock

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2,850

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Epart123

USA . 2,500 parts In-Stock

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$1.250

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$1.250

2,500

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$1.250

$1.250

GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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Corphita

USA . 2,416 parts In-Stock

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2,416

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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2,400

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Assy Fe

Spain . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 794 parts In-Stock

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$0.827

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794

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$0.827

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Overview

Unlock the power of efficiency with the STS4DPF30L from STMicroelectronics—your go-to solution for reliable switching applications. Known for their exceptional quality and innovation, STMicroelectronics delivers top-tier performance in a compact design. This P-channel Power FET is ideal for demanding environments, ensuring robust durability while optimizing energy use. Elevate your projects with unmatched reliability and experience seamless integration in various applications today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package ensures durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: P-CHANNEL

P-channel devices are often used in high-side switching applications, allowing for simplified circuit designs.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration provides added functionality with integrated protection against reverse polarity, improving circuit reliability.

Transistor Application: SWITCHING

Optimized for switching applications, this FET is ideal for controlling power delivery in various electronic devices.

Surface Mount: YES

Surface mount technology (SMT) enables compact designs, contributing to smaller, lighter, and more efficient PCB layouts.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures the device can handle typical voltage levels found in various applications, enhancing reliability.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of board space and simplifies the layout for design engineers.

Terminal Form: GULL WING

Gull wing terminals provide a secure and reliable connection to the PCB, enhancing mechanical stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation delivers better performance in low-voltage applications, making it suitable for power-efficient designs.

No. of Elements: 2

With two elements, this FET can be leveraged for dual-channel applications, offering flexibility in design.

Maximum Pulsed Drain Current (IDM): 16 A

A high pulsed drain current capability allows for superior performance under transient load conditions.

Maximum Drain Current (Abs) (ID): 4 A

An absolute maximum drain current rating of 4A enables reliable operation in many current-driven applications.

No. of Terminals: 8

Eight terminals provide additional connection options, accommodating various circuit designs and configurations.

Maximum Power Dissipation (Abs): 2 W

A maximum power dissipation of 2W highlights the FET's ability to handle heat effectively, promoting longevity and reliability.

Package Style (Meter): SMALL OUTLINE

Small outline packages allow for high-density PCB designs, ideal for compact electronic products.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high efficiency and low power consumption, making this FET suitable for energy-sensitive applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating increases the FET's versatility, enabling it to perform reliably in demanding environments.

Transistor Element Material: SILICON

Silicon-based FETs offer excellent thermal and electrical performance, making them a standard choice in power applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finishes provide excellent solderability and corrosion resistance, ensuring long-term performance in various conditions.

Maximum Drain Current (ID): 4 A

This rating indicates suitability for a range of applications where moderate current handling is required.

Maximum Drain-Source On Resistance: 0.1 ohm

A low on-resistance value minimizes power loss during operation, enhancing overall efficiency in power applications.

Terminal Position: DUAL

Dual terminal positioning allows for versatile PCB placement and design options, enhancing usability in complex applications.

Maximum Time At Peak Reflow Temperature: 30 s

A peak reflow time of 30 seconds aligns with standard soldering practices, ensuring compatibility with automated assembly processes.

Peak Reflow Temperature: 225 C

The peak temperature of 225 °C is compatible with modern reflow soldering techniques, facilitating efficient manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) STS4DPF30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

225

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS4DPF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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