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STS4DNF30L

STMicroelectronics

STS4DNF30L by STMicroelectronics

STS4DNF30L by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 4 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,704 parts In-Stock

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7,704

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Bristol Electronics

USA . 7,237 parts In-Stock

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7,237

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Atlantic Semiconductor

USA . 7,237 parts In-Stock

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7,237

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Digiode

USA . 4,750 parts In-Stock

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4,750

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ComSIT Distribution GmbH

Germany . 1,650 parts In-Stock

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1,650

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Anansix

USA . 987 parts In-Stock

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987

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Cogito LLC

Ukraine . 12 parts In-Stock

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Speed Components Ltd

Israel . 12 parts In-Stock

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12

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,706 parts In-Stock

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$0.752

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$0.676

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1,706

$0.752

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$0.676

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MKK Technologies

India . 1,690 parts In-Stock

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$1.413

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$1.413

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DigiPath Technology Company

USA . 1,690 parts In-Stock

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$1.413

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1,690

$1.413

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AZTECH Wire

Italy . 924 parts In-Stock

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$13.310

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924

$13.310

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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RC Electronics

USA . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,761 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Corphita

USA . 2,906 parts In-Stock

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Parana Technologies

USA . 1,794 parts In-Stock

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$0.899

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1,794

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$0.899

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Perfect Parts

USA . 775 parts In-Stock

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775

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Overview

Unlock unparalleled performance with the STS4DNF30L from STMicroelectronics, a leading name in semiconductor innovation. This N-channel power FET is designed for seamless switching applications, boasting superior reliability and efficiency. Its compact surface mount design ensures easy integration into your projects, while its robust construction guarantees longevity even under demanding conditions. Elevate your designs with unmatched quality and experience the benefits of advanced technology tailored for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various environments, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance and are capable of handling higher currents, enhancing overall efficiency.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having separate elements with built-in diode improves the versatility for applications requiring reverse polarity protection.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast response times and high efficiency, ideal for power management.

Surface Mount: YES

Surface mount capability facilitates compact design and efficient use of PCB space, which is essential in modern electronic devices.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V makes it suitable for applications where higher voltage handling is crucial.

Package Shape: RECTANGULAR

Rectangular package shape helps in easier placement on PCBs, optimizing space and layout configurations.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering characteristics, ensuring better mechanical stability and electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency due to lower on-resistance when in the 'on' state.

No. of Elements: 2

Having two elements offers the ability to manage both switching and control operations effectively in one package.

Maximum Pulsed Drain Current (IDM): 16 A

A maximum pulsed drain current of 16A enables it to handle dynamic load conditions without failure.

Maximum Drain Current (Abs) (ID): 4 A

With a maximum absolute drain current of 4A, this FET is well-suited for moderate power applications.

No. of Terminals: 8

The 8 terminals allow for flexibility in circuit design and connectivity options, facilitating various applications.

Maximum Power Dissipation (Abs): 2 W

A maximum power dissipation of 2W indicates effective thermal management, critical for high-performance applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for increased component density on circuit boards.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology provides high efficiency and fast switching capabilities, making it highly suitable for digital circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C ensures reliable performance in demanding thermal environments.

Transistor Element Material: SILICON

Built from silicon, this FET benefits from excellent semiconductor properties, providing robust electrical performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish enhances corrosion resistance and ensures reliable electrical connections over time.

Maximum Drain Current (ID): 4 A

The specified maximum drain current of 4A supports sustained operation in various power applications.

Maximum Drain-Source On Resistance: 0.06 ohm

A low on-resistance of 0.06 ohm minimizes power loss and heat generation, improving power efficiency.

Terminal Position: DUAL

Dual terminal positioning simplifies circuit integration and provides design versatility for electronic devices.

Technical Specifications

Power Field Effect Transistors (FET) STS4DNF30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS4DNF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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