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STP8NM60D

STMicroelectronics

STP8NM60D by STMicroelectronics

STP8NM60D by STMicroelectronics is an N-channel MOSFET ideal for switching applications, featuring a 600V breakdown voltage and 8A max drain current. It offers a low on-resistance of 1Ω and operates at up to 150 °C. This versatile FET is suitable for various power management tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,979 parts In-Stock

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Digiode

USA . 3,319 parts In-Stock

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Anansix

USA . 693 parts In-Stock

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IDEA Electronic Components Group

UK . 2,100 parts In-Stock

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$1.292

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$1.163

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$1.292

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$1.163

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MKK Technologies

India . 87 parts In-Stock

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$2.429

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87

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DigiPath Technology Company

USA . 87 parts In-Stock

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$2.429

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87

$2.429

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AZTECH Wire

Italy . 1,014 parts In-Stock

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$12.870

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$12.870

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,634 parts In-Stock

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Corphita

USA . 4,152 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,802 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 69 parts In-Stock

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$1.544

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$1.544

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Overview

Elevate your projects with the STP8NM60D from STMicroelectronics, a powerhouse in the world of power FETs. Renowned for their exceptional quality and reliability, STMicroelectronics delivers unmatched performance, ensuring efficiency in switching applications. With its robust design, this N-channel transistor excels in high-voltage environments, providing maximum durability and safety. Experience improved energy management and streamlined operations—unlocking value that makes a difference in every application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, making the transistor suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance, featuring higher electron mobility which translates to faster switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by providing intrinsic protection against reverse polarity, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers efficient performance in various electronic devices and power management systems.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this transistor is suitable for high-voltage applications, ensuring robust operation and reliability.

Package Shape: RECTANGULAR

The rectangular package shape ensures efficient use of space on PCBs and facilitates better thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide solid mechanical support and are ideal for soldering in permanent applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers a normally-off state, allowing for greater control over the device in circuit designs.

Maximum Pulsed Drain Current (IDM): 32 A

This high pulsed current rating makes it suitable for demanding applications requiring quick surges of power.

Avalanche Energy Rating (EAS): 200 mJ

The ability to handle substantial avalanche energy enhances reliability during transient events, making it safer for use in fluctuating environments.

Maximum Drain Current (Abs) (ID): 8 A

The specified maximum drain current ensures the transistor can effectively handle moderate power levels in various circuits.

No. of Terminals: 3

With three terminals, this FET allows for flexible circuit configurations while ensuring compact design.

Maximum Power Dissipation (Abs): 100 W

A high power dissipation capability means better thermal management, leading to longer lifespans and increased reliability in high-load applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides better stability and heat dissipation, enabling secure installation in various environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers lower on-resistance and power consumption, making it efficient and suitable for modern applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures ensures the transistor remains functional even in extreme thermal conditions.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its excellent electrical properties, making this transistor reliable and effective.

Terminal Finish: TIN

Tin finishes enhance solderability and ensure reliable connections in electronic components.

Maximum Drain Current (ID): 8 A

Repeating this rating emphasizes its consistent performance characteristics, ensuring it can meet the demands of various applications.

Maximum Drain-Source On Resistance: 1 ohm

A low on-resistance value contributes to lower power losses, allowing for greater overall efficiency in power switching applications.

Terminal Position: SINGLE

Having a single terminal position allows for easier integration into designs, lending to a simpler layout in PCB designs.

Technical Specifications

Power Field Effect Transistors (FET) STP8NM60D attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP8NM60D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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