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STM32MP133DAE7

STMicroelectronics

STM32MP133DAE7 by STMicroelectronics

STM32MP133DAE7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and operates b/w -40 °C to 105 °C. It features integrated cache, low power mode, and supports up to 56 DMA channels. Ideal for embedded applications requiring efficient processing in compact designs.

Median Price

$9.680

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$9.670

100+ parts

$6.500

1k+ parts

$6.220

10k+ parts

$5.840

200

$9.670

$6.500

$6.220

$5.840

Mouser Electronics

USA . 117 parts In-Stock

1+ parts

$9.690

100+ parts

$7.020

1k+ parts

$5.770

10k+ parts

-

117

$9.690

$7.020

$5.770

-

DigiKey

USA . 76 parts In-Stock

1+ parts

$9.980

100+ parts

$6.623

1k+ parts

$6.017

10k+ parts

-

76

$9.980

$6.623

$6.017

-

Verical

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$6.500

1k+ parts

$6.310

10k+ parts

-

200

-

$6.500

$6.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,200 parts In-Stock

1+ parts

$8.835

100+ parts

-

1k+ parts

-

10k+ parts

-

2,200

$8.835

-

-

-

Vyrian

USA . 4,133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,133

-

-

-

-

Anansix

USA . 2,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,610

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,479 parts In-Stock

1+ parts

$8.370

100+ parts

-

1k+ parts

-

10k+ parts

-

4,479

$8.370

-

-

-

Overview

Elevate your projects with the STM32MP133DAE7 from STMicroelectronics, a trusted leader in microprocessor innovation. This powerhouse combines exceptional performance with low power consumption, making it ideal for advanced applications in industrial control, IoT devices, and smart home technology. Experience unparalleled reliability and support, ensuring your designs stand out in today’s competitive market while benefiting from cutting-edge features and robust functionality that drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves data access speeds and overall performance, enhancing processing efficiency.

Surface Mount: YES

Surface mount technology allows for compact design and improved circuit density, making it an ideal choice for modern electronic devices.

Maximum Supply Voltage: 1.38 V

A maximum supply voltage of 1.38V helps in reducing power consumption, which is crucial for battery-operated devices.

On Chip Data RAM Width: 8

An 8-bit data RAM width allows for efficient data processing and throughput, suitable for various embedded applications.

Address Bus Width: 26

A 26-bit address bus width enables access to a larger memory space, improving the range of applications for the microprocessor.

Package Shape: SQUARE

The square package shape simplifies layout planning on circuit boards and aids in efficient heat dissipation.

Bit Size: 32

A 32-bit architecture allows for higher data processing capabilities, making it suitable for complex applications.

No. of Terminals: 289

A higher number of terminals offers more connectivity options, providing flexibility in circuit design and functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile fine pitch grid array style saves space and allows for easier mounting on PCB, enhancing manufacturing efficiency.

Minimum Supply Voltage: 1.32 V

A low minimum supply voltage contributes to energy efficiency, making it well-suited for portable applications.

Maximum Operating Temperature: 105 °C

Operating at high temperatures ensures reliability in demanding environments, extending its application areas.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures makes this microprocessor suitable for harsh conditions.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat transfer and can improve assembly in compact designs.

Maximum Seated Height: 1.7 mm

A low seated height contributes to a smaller overall footprint, perfect for space-constrained designs.

RAM Words: 172032

A significant amount of RAM words enhances data storage and retrieval capabilities, beneficial for data-intensive applications.

Width: 14 mm

Compact width allows for a more efficient layout on circuit boards, accommodating smaller devices.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging, improving reliability and simplifying development processes.

External Data Bus Width: 16

A 16-bit external data bus width provides good data handling capacity for various applications, ensuring robust performance.

Maximum Clock Frequency: 48 MHz

With a maximum clock frequency of 48 MHz, this microprocessor can handle decent processing tasks efficiently.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor optimizes instruction formats, improving performance and reducing processor complexity.

Technology: CMOS

CMOS technology contributes to low power consumption and high noise immunity, beneficial for portable devices.

Terminal Form: BALL

Ball terminal form offers good electrical performance and mechanical strength, enhancing reliability in connections.

Maximum Supply Current: 268 mA

Moderate supply current helps maintain an efficient power profile, making the product suitable for low-power applications.

Nominal Supply Voltage: 1.35 V

A nominal supply voltage of 1.35V indicates optimally engineered power requirements for energy-efficient designs.

No. of DMA Channels: 56

A large number of DMA channels allows for efficient data transfer processes without burdening the CPU, enhancing multitasking capabilities.

No. of Serial I/Os: 10

Having 10 serial I/Os enables versatile connectivity options for peripheral devices, improving the utility of the microprocessor.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch provides a balance between density and manufacturability, suitable for advanced PCB designs.

Format: FIXED POINT

Fixed point format processing allows for precise arithmetic operations, enhancing performance in computational tasks.

Speed: 1000 rpm

The specified speed is indicative of performance metrics, enhancing operational efficiency in a variety of contexts.

Low Power Mode: YES

Support for low power mode is vital for energy conservation in portable devices, extending battery life and enhancing user experience.

Technical Specifications

Microprocessors STM32MP133DAE7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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