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STM32MP133CAF3T

STMicroelectronics

STM32MP133CAF3T by STMicroelectronics

STM32MP133CAF3T by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 125 °C, making it ideal for industrial applications. Its compact design features a thin profile grid array package with 320 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,685 parts In-Stock

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11,685

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Anansix

USA . 2,001 parts In-Stock

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2,001

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ComSIT Distribution GmbH

Germany . 1,850 parts In-Stock

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1,850

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Digiode

USA . 1,622 parts In-Stock

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1,622

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Distributors (Availability)

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AZTECH Wire

Italy . 915 parts In-Stock

1+ parts

$11.420

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915

$11.420

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Corphita

USA . 2,581 parts In-Stock

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Overview

Unlock the potential of your next project with the STM32MP133CAF3T from STMicroelectronics, a leading name in innovative microprocessors. Designed for exceptional performance and energy efficiency, this versatile chip excels in applications ranging from industrial automation to smart home devices. With its robust reliability and extreme temperature tolerance, it delivers unparalleled value, empowering you to create cutting-edge solutions that stand out in today’s technology landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing plastic/epoxy materials enhances durability and heat resistance, ensuring reliable performance in various environments.

Integrated Cache: YES

The presence of an integrated cache improves data access speeds, leading to better overall performance of the microprocessor.

Surface Mount: YES

Surface mount capability allows for more compact and efficient circuit designs, saving space in electronic devices.

Maximum Supply Voltage: 1.38 V

The low maximum supply voltage indicates that this microprocessor is designed to operate efficiently and consume minimal power.

On Chip Data RAM Width: 8

An 8-bit data RAM width aids in handling data operations smoothly while fitting well within typical applications requiring moderate data handling.

Address Bus Width: 26

A 26-bit address bus width allows for accessing a larger memory space, enhancing the microprocessor's ability to handle complex applications.

Package Shape: SQUARE

The square package shape promotes efficient use of PCB space and aligns with standard mounting techniques.

Bit Size: 32

A 32-bit architecture enables the execution of more complex programs, facilitating better performance in modern computing tasks.

Number of Terminals: 320

Having 320 terminals provides extensive connectivity options for integrating with various peripherals and devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This design enhances the microprocessor's thermal and electrical performance, making it suitable for high-density applications.

Minimum Supply Voltage: 1.21 V

A low minimum supply voltage allows for flexible power supply options, contributing to energy efficiency.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature expands the range of applications, making it suitable for demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold makes this microprocessor well-suited for outdoor or industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in efficient heat dissipation and is conducive to effective PCB design.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a compact design and helps in improving airflow and heat management on the PCB.

RAM Words: 172032

A substantial number of RAM words supports complex computations and multitasking capabilities.

Width: 11 mm

A standard width of 11 mm allows for compatibility with various PCB layouts and designs.

Boundary Scan: YES

Boundary scan capability aids in improved debugging and testing processes, streamlining production and maintenance.

External Data Bus Width: 16

A 16-bit external data bus width allows for efficient data transfer between the microprocessor and peripherals.

Maximum Clock Frequency: 48 MHz

A 48 MHz maximum clock frequency ensures swift data processing and responsiveness in applications.

Length: 11 mm

An equal length of 11 mm keeps the microprocessor symmetric and proportional, aiding in thermal management.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor optimizes performance through efficient instruction execution and power management.

Technology: CMOS

CMOS technology features low power consumption and high integration density, making it a prime choice for modern electronics.

Terminal Form: BALL

Ball terminal form provides better soldering and connection reliability, crucial for high-performance applications.

Maximum Supply Current: 239 mA

A reasonable maximum supply current ensures that the microprocessor can perform efficiently without excessive power draw.

Nominal Supply Voltage: 1.25 V

A nominal supply voltage of 1.25 V strikes a balance between performance and power efficiency.

Number of DMA Channels: 56

Having multiple DMA channels enhances data transfer capabilities, optimizing processing performance.

Number of Serial I/Os: 10

Ten serial I/O options provide flexibility and extensive interfacing capabilities for various applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is suitable for high-density designs, enabling compact and effective PCB layouts.

Format: FIXED POINT

Fixed point format is efficient for specific arithmetic operations, providing quick processing in many applications.

Speed: 650 rpm

A speed of 650 rpm suggests that this microprocessor can effectively manage real-time tasks, enhancing system performance.

Low Power Mode: YES

The availability of a low power mode helps extend battery life and reduce energy consumption during idle states.

Technical Specifications

Microprocessors STM32MP133CAF3T attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

10

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

650 rpm

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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