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STM32MP131FAF7

STMicroelectronics

STM32MP131FAF7 by STMicroelectronics

STM32MP131FAF7 by STMicroelectronics is a 32-bit RISC microprocessor with a max clock frequency of 48 MHz and integrated cache. It operates b/w -40 °C to 105 °C, making it ideal for industrial applications. Its low power mode and extensive I/O support enhance versatility in embedded systems.

Median Price

$10.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 160 parts In-Stock

1+ parts

$10.812

100+ parts

$6.776

1k+ parts

$5.073

10k+ parts

-

160

$10.812

$6.776

$5.073

-

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$10.900

100+ parts

$6.880

1k+ parts

$6.320

10k+ parts

-

200

$10.900

$6.880

$6.320

-

Mouser Electronics

USA . 310 parts In-Stock

1+ parts

$10.990

100+ parts

$7.030

1k+ parts

$5.280

10k+ parts

-

310

$10.990

$7.030

$5.280

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 311 parts In-Stock

1+ parts

$7.778

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$7.778

-

-

-

Vyrian

USA . 2,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,440

-

-

-

-

Anansix

USA . 150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

150

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 258 parts In-Stock

1+ parts

$7.368

100+ parts

-

1k+ parts

-

10k+ parts

-

258

$7.368

-

-

-

Overview

Unlock the potential of your next innovation with the STM32MP131FAF7 microprocessor from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers a powerhouse designed for efficiency and reliability in various applications, from industrial automation to smart home devices. With low power consumption and robust performance, this microprocessor ensures seamless operations while enhancing your product’s value, empowering you to stay ahead in a competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliable performance and longevity under various conditions.

Integrated Cache: YES

The inclusion of integrated cache enables faster data access, improving overall processing speed.

Surface Mount: YES

Surface mount compatibility allows for easier integration into modern compact circuit designs.

Maximum Supply Voltage: 1.38 V

A maximum supply voltage of 1.38 V ensures compatibility with low-power applications without sacrificing performance.

On Chip Data RAM Width: 8

This specification supports efficient data handling capabilities, enhancing the microprocessor's performance.

Address Bus Width: 26

A wider address bus width allows for addressing more memory, which is beneficial for complex applications.

Package Shape: SQUARE

A square package shape optimizes space utilization on PCBs, facilitating efficient circuit layout.

Bit Size: 32

A 32-bit architecture supports advanced computation and larger data processing capabilities, suitable for modern applications.

No. of Terminals: 320

A higher number of terminals allows for extensive connections, supporting multifunctional designs.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style maximizes performance in space-constrained environments, making it ideal for advanced electronics.

Minimum Supply Voltage: 1.32 V

A low minimum supply voltage enhances energy efficiency, making the microprocessor suitable for battery-operated devices.

Maximum Operating Temperature: 105 °C

High-temperature resilience ensures the microprocessor operates reliably in demanding environments.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures makes this microprocessor suitable for harsh conditions and outdoor applications.

Terminal Position: BOTTOM

Bottom terminal positioning aids in better thermal management and compact design implementation.

Maximum Seated Height: 1.2 mm

A low seated height contributes to low-profile designs, making it suitable for sleek, modern electronics.

RAM Words: 172032

A substantial number of RAM words allows for smooth multitasking and handling of large data sets.

Width: 11 mm

Compact width minimizes space usage, allowing for more efficient and smaller circuit designs.

Boundary Scan: YES

Boundary scan capability enhances debugging and testing processes, ensuring reliable performance in the field.

External Data Bus Width: 16

A 16-bit external data bus width supports efficient data transfer, making it suited for high-performance applications.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz provides the processing speed required for complex applications and tasks.

Length: 11 mm

The compact length facilitates integration into space-sensitive designs, promoting versatility.

Peripheral IC Type: MICROPROCESSOR, RISC

Utilizing RISC architecture enhances processing efficiency and performance, leading to better overall system responsiveness.

Technology: CMOS

CMOS technology contributes to low power consumption while maintaining high speed, ideal for portable devices.

Terminal Form: BALL

Ball terminal form allows for better soldering quality and improved electrical connections in high-density layouts.

Maximum Supply Current: 268 mA

A manageable supply current aids in power efficiency, essential for modern energy-conscious applications.

Nominal Supply Voltage: 1.35 V

Operating at a nominal supply voltage of 1.35 V enhances power efficiency and thermal management.

No. of DMA Channels: 56

A high count of DMA channels improves data handling capabilities, supporting high-throughput environments.

No. of Serial I/Os: 8

Multiple serial I/Os provide flexibility in interfacing with various devices, enhancing application versatility.

Terminal Pitch: 0.5 mm

A fine terminal pitch facilitates high-density layouts, aiding in the design of sophisticated electronic systems.

Format: FIXED POINT

Fixed-point format allows for precise numerical processing, beneficial in performance-critical applications.

Speed: 1000 rpm

High operating speed supports faster processing and responsiveness, making it ideal for real-time applications.

Low Power Mode: YES

Low power mode capability enables energy savings, extending battery life in portable devices.

Technical Specifications

Microprocessors STM32MP131FAF7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B320

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

320

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA320,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.2 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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