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STM32MP131FAE7

STMicroelectronics

STM32MP131FAE7 by STMicroelectronics

STM32MP131FAE7 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words, 48 MHz clock frequency, and 56 DMA channels. Ideal for low power applications in automotive, industrial automation, and consumer electronics due to its CMOS technology and integrated cache. It features a compact square package with a grid array style and operates b/w -40°C to 105°C temperature range.

Median Price

$5.694

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$5.070

100+ parts

$4.970

1k+ parts

-

10k+ parts

-

200

$5.070

$4.970

-

-

Arrow

USA . 308 parts In-Stock

1+ parts

$6.317

100+ parts

-

1k+ parts

-

10k+ parts

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308

$6.317

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-

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Avnet

USA . 833 parts In-Stock

1+ parts

-

100+ parts

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833

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Verical

USA . 308 parts In-Stock

1+ parts

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308

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Distributors (In-Stock)

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Digiode

USA . 2,421 parts In-Stock

1+ parts

$8.227

100+ parts

-

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10k+ parts

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2,421

$8.227

-

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Vyrian

USA . 6,716 parts In-Stock

1+ parts

-

100+ parts

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6,716

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Anansix

USA . 1,510 parts In-Stock

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1,510

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Nova Conductors

Japan . 33 parts In-Stock

1+ parts

-

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33

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,006 parts In-Stock

1+ parts

$7.794

100+ parts

-

1k+ parts

-

10k+ parts

-

1,006

$7.794

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Ampacity Inc.

Singapore . 324 parts In-Stock

1+ parts

$15.020

100+ parts

-

1k+ parts

-

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324

$15.020

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AZTECH Wire

Italy . 1,111 parts In-Stock

1+ parts

$15.670

100+ parts

-

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1,111

$15.670

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Aranea Global

USA . 999 parts In-Stock

1+ parts

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999

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Overview

Discover the cutting-edge STM32MP131FAE7 microprocessor by STMicroelectronics, a true game-changer in the industry. With top-tier quality and advanced technology, this product offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, the STM32MP131FAE7 delivers exceptional value and benefits to customers seeking high-speed processing, low power consumption, and seamless integration. Trust in STMicroelectronics for innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this microprocessor lightweight and durable, making it easy to handle and less prone to damage during handling or installation.

Integrated Cache: YES

Having integrated cache ensures faster access to frequently used instructions or data, improving overall performance and efficiency of the microprocessor.

Surface Mount: YES

Being surface mountable enables easy and efficient soldering onto a printed circuit board, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 1.38 V

The maximum supply voltage of 1.38 V ensures safe and stable operation of the microprocessor without the risk of overloading or overheating.

On Chip Data RAM Width: 8

The on-chip data RAM width of 8 allows for quick access to data stored on the microprocessor, improving data processing speeds and overall performance.

Address Bus Width: 26

With an address bus width of 26, the microprocessor can access a large memory space efficiently, allowing for handling of complex computational tasks and large datasets.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to integrate into tight spaces or densely populated PCB layouts.

Bit Size: 32

Having a 32-bit architecture allows for processing and handling of larger data sets and complex instructions, enhancing the overall performance and capabilities of the microprocessor.

No. of Terminals: 289

The high number of terminals enables connectivity with various external components and peripherals, enhancing the versatility and functionality of the microprocessor.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high density integration, precise alignment, and optimal signal transmission, improving overall performance and reliability.

Minimum Supply Voltage: 1.32 V

The minimum supply voltage of 1.32 V ensures that the microprocessor can operate efficiently and reliably even under low power conditions, conserving energy and reducing operating costs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microprocessor can withstand harsh environmental conditions and perform consistently without thermal issues.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments, making the microprocessor suitable for a wide range of applications.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections with other components on the PCB, ensuring reliable signal transmission and easy integration.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7 mm allows for compact and slim device designs, enabling space-saving and lightweight product configurations.

RAM Words: 172032

The large number of RAM words enables efficient storage and retrieval of data, allowing for seamless multitasking and faster data processing capabilities.

Width: 14 mm

The compact width of 14 mm ensures compatibility with various PCB layouts and form factors, making it easy to integrate into a wide range of electronic devices.

Boundary Scan: YES

Having boundary scan capability enables easier testing and fault detection during manufacturing and maintenance processes, improving overall product reliability and quality.

External Data Bus Width: 16

With an external data bus width of 16, the microprocessor can efficiently transfer data between external devices, enhancing connectivity and communication capabilities.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz allows for fast data processing and execution of instructions, improving overall performance and responsiveness of the microprocessor.

Length: 14 mm

The compact length of 14 mm ensures compatibility with various form factors and PCB layouts, enabling easy integration into a wide range of electronic devices.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it offers simplified instruction set, reduced complexity, and enhanced performance for specific applications, making it a suitable choice for embedded systems and IoT devices.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and reliable operation, making the microprocessor efficient, stable, and suitable for battery-powered devices.

Terminal Form: BALL

Having ball terminal form enables secure and reliable connections with other components, ensuring good electrical contact and easy soldering for robust and stable system integration.

Maximum Supply Current: 268 mA

The maximum supply current of 268 mA indicates efficient power management and low energy consumption, making the microprocessor suitable for battery-operated devices and energy-efficient applications.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage of 1.35 V provides a stable operating voltage for the microprocessor, ensuring consistent performance and minimizing power consumption for efficient operation.

No. of DMA Channels: 56

Having 56 DMA channels allows for efficient data transfer and management between peripherals and memory, enhancing overall system performance and enabling high-speed data processing.

No. of Serial I/Os: 8

The 8 serial I/Os provide connectivity options for external devices and peripherals, enabling versatile communication and interfacing capabilities for a wide range of applications.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm facilitates easy integration and soldering onto a PCB, ensuring secure connections and reliable signal transmission for stable and robust system operation.

Format: FIXED POINT

Being a fixed-point format microprocessor, it offers efficient and fast integer arithmetic operations, making it suitable for applications that require high-speed data processing and precise calculations.

Speed: 1000 rpm

With a speed of 1000 rpm, the microprocessor can efficiently execute instructions and process data at a high rate, ensuring rapid performance and responsiveness in demanding applications.

Low Power Mode: YES

Having a low power mode allows the microprocessor to conserve energy and reduce power consumption when operating in less demanding tasks or idle states, making it energy-efficient and environmentally friendly.

Technical Specifications

Microprocessors STM32MP131FAE7 attributes and parameters. Explore more Microprocessors devices from STMicroelectronics

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

48 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B289

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

56

No. of Serial I/Os:

8

No. of Terminals:

289

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

RAM Words:

172032

Maximum Seated Height:

1.7 mm

Speed:

1000 rpm

Maximum Supply Current:

268 mA

Maximum Supply Voltage:

1.38 V

Minimum Supply Voltage:

1.32 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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