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STL8NH3LL

STMicroelectronics

STL8NH3LL by STMicroelectronics

STL8NH3LL by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 8 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 55 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

$0.551

55

$2.070

-

-

$0.551

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 30 parts In-Stock

1+ parts

$1.150

100+ parts

$0.870

1k+ parts

$0.750

10k+ parts

-

30

$1.150

$0.870

$0.750

-

Digiode

USA . 1,781 parts In-Stock

1+ parts

$1.966

100+ parts

-

1k+ parts

-

10k+ parts

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1,781

$1.966

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Vyrian

USA . 1,289 parts In-Stock

1+ parts

$2.070

100+ parts

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1,289

$2.070

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Anansix

USA . 418 parts In-Stock

1+ parts

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418

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$0.845

100+ parts

$0.769

1k+ parts

$0.693

10k+ parts

-

3,000

$0.845

$0.769

$0.693

-

IDEA Electronic Components Group

UK . 1,954 parts In-Stock

1+ parts

$1.432

100+ parts

-

1k+ parts

$1.288

10k+ parts

-

1,954

$1.432

-

$1.288

-

Corphita

USA . 1,965 parts In-Stock

1+ parts

$1.863

100+ parts

-

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-

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1,965

$1.863

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MKK Technologies

India . 1,594 parts In-Stock

1+ parts

$2.692

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

$2.692

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-

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$2.692

100+ parts

-

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1,594

$2.692

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Perfect Parts

USA . 27,847 parts In-Stock

1+ parts

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27,847

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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100+ parts

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25,000

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Metaverse IC Inc.

Canada . 9,000 parts In-Stock

1+ parts

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9,000

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Kepictronics

USA . 7,000 parts In-Stock

1+ parts

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7,000

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 5,107 parts In-Stock

1+ parts

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5,107

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Alle Elektronik GmbH

Germany . 3,546 parts In-Stock

1+ parts

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3,546

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A-Z Elektronik GmbH

Germany . 2,340 parts In-Stock

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2,340

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 213 parts In-Stock

1+ parts

-

100+ parts

$1.712

1k+ parts

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213

-

$1.712

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Microchip USA

USA . 207 parts In-Stock

1+ parts

-

100+ parts

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207

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Overview

Unlock the potential of your projects with the STL8NH3LL from STMicroelectronics, a leader in innovative technology. This high-performance N-channel power FET excels in switching applications, offering reliability and efficiency that enhance any design. With its compact surface-mount package and built-in diode, it simplifies integration while delivering superior thermal management and low on-resistance. Elevate your systems with a trusted component designed for excellence in every facet!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally provide faster switching speeds and better conductivity, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances versatility in circuit designs, allowing for better management of reverse currents and increased protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can effectively control power delivery, improving efficiency in electronic devices.

Surface Mount: YES

Being surface mountable allows for easier integration into compact circuit designs, saving space and improving performance.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this FET can operate reliably in a variety of applications without risk of damage from overvoltage.

Package Shape: SQUARE

The square package shape provides a stable mounting footprint, ensuring reliable performance even in demanding applications.

Terminal Form: NO LEAD

No lead design facilitates enhanced reliability and compatibility with modern surface mount technology, reducing potential failure points.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation makes this FET ideal for applications requiring high input impedance and low static power consumption.

Maximum Pulsed Drain Current (IDM): 32 A

A high pulsed drain current of 32A indicates that this FET can handle transient loads, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 8 A

The absolute maximum drain current of 8A allows for reliable operation in applications where current levels are moderate yet substantial.

No. of Terminals: 9

Having 9 terminals offers flexibility in connection options, enhancing design adaptability for various circuit applications.

Maximum Power Dissipation (Abs): 50 W

With a maximum power dissipation of 50W, this FET can handle significant thermal loads, ensuring reliability in demanding environments.

Package Style (Meter): FLATPACK

The flatpack style enhances thermal performance and provides a low-profile option for space-constrained designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOSFET technology, this product demonstrates high efficiency and low power loss, beneficial for modern electronic applications.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures (up to 150 °C) allows this FET to be used in harsh environments without loss of performance.

Transistor Element Material: SILICON

Silicon as the transistor material ensures good performance, thermal stability, and reliability, essential for electronic components.

Terminal Finish: MATTE TIN

The matte tin finish offers excellent solderability and corrosion resistance, ensuring longer-lasting connections in various applications.

Maximum Drain-Source On Resistance: 0.017 ohm

A low on-resistance of 0.017 ohm minimizes power loss during operation, enhancing efficiency and performance in switching applications.

Terminal Position: QUAD

The quad terminal position provides versatility in circuit layouts, allowing for easier integration and enhanced thermal performance.

Case Connection: DRAIN

Direct connection of the drain ensures efficient heat dissipation and minimal resistance, crucial for high-performance applications.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with various soldering processes while minimizing thermal stress on the component.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability (260 °C) allows for compatibility with lead-free solder technologies in modern manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) STL8NH3LL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.017 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XQFP-N9

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

9

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL8NH3LL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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