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STL20DNF06LAG

STMicroelectronics

STL20DNF06LAG by STMicroelectronics

STL20DNF06LAG by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 20 A, a breakdown voltage of 60 V, and low on-resistance of 0.05 Ω. Ideal for automotive and power management systems, it ensures reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,063 parts In-Stock

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4,063

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Digiode

USA . 3,244 parts In-Stock

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Anansix

USA . 1,596 parts In-Stock

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1,596

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$1.225

100+ parts

$1.115

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$1.004

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70

$1.225

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$1.004

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$1.266

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$1.139

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537

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MKK Technologies

India . 1,951 parts In-Stock

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$2.380

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DigiPath Technology Company

USA . 1,951 parts In-Stock

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$2.380

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AZTECH Wire

Italy . 462 parts In-Stock

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$16.600

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Component Stockers USA

USA . 580 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,629 parts In-Stock

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Corphita

USA . 958 parts In-Stock

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Parana Technologies

USA . 643 parts In-Stock

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$1.514

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Overview

Unlock superior efficiency and reliability with the STL20DNF06LAG from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Power FET is expertly designed for high-performance switching applications, offering remarkable durability and low resistance for enhanced power management. Ideal for automotive and industrial uses, it ensures optimal performance while reducing energy costs, making it the smart choice for forward-thinking engineers looking to elevate their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and reliability, making it suitable for various applications in challenging environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide higher efficiency and better performance in switching applications, making this FET ideal for power management.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

Having two separate elements with built-in diodes enhances the functionality and versatility of the FET, allowing for improved circuit designs.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently handle rapid on/off operations, making it suitable for power converters and motor controllers.

Surface Mount: YES

The surface mount capability allows for compact design and ease of integration into automated assembly processes, optimizing production efficiency.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60 V provides a robust performance in high-voltage applications, ensuring reliability under severe conditions.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient space utilization on PCBs, supporting compact circuit designs.

Terminal Form: FLAT

Flat terminal form optimizes contact area, ensuring effective heat dissipation and reliable electrical connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for improved control over the transistor, contributing to lower on-resistance and better power efficiency.

No. of Elements: 2

Having two elements enhances parallel operation capabilities, enabling higher power handling in applications.

Maximum Pulsed Drain Current (IDM): 80 A

The high maximum pulsed drain current allows for handling of significant transient loads, making it versatile for dynamic applications.

Avalanche Energy Rating (EAS): 210 mJ

An avalanche energy rating of 210 mJ indicates robustness against voltage spikes, protecting the circuit from damage in harsh conditions.

No. of Terminals: 6

Having six terminals enhances connectivity options, providing flexibility in circuit layout and design.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space savings on boards while maintaining high performance, making it suitable for compact applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed switching and lower power consumption, making this FET efficient for various power applications.

Transistor Element Material: SILICON

Silicon offers excellent thermal characteristics and reliability, making it the preferred choice for high-performance transistors.

Maximum Drain Current (ID): 20 A

The capability to handle a maximum drain current of 20 A allows for effective power transmission in diverse applications.

Maximum Drain-Source On Resistance: 0.05 ohm

A low on-resistance minimizes power losses during operation, thus enhancing the overall efficiency of the circuit.

Terminal Position: DUAL

Dual terminal position enables straightforward connections in circuit boards, enhancing the ease of design integration.

Case Connection: DRAIN

The direct drain connection improves performance in switching applications, optimizing power flow and thermal management.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 ensures quality and reliability for automotive applications, making this FET suitable for safety-critical systems.

Technical Specifications

Power Field Effect Transistors (FET) STL20DNF06LAG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

210 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.05 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL20DNF06LAG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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