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STIEC45-26ACS

STMicroelectronics

STIEC45-26ACS by STMicroelectronics

STIEC45-26ACS by STMicroelectronics is a bidirectional transient voltage suppressor diode, ideal for protecting sensitive electronics. It operates b/w -55 °C to 150 °C, with a breakdown voltage of 28.9V to 31.9V. This compact device ensures compliance with IEC standards for robust surge protection.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,347 parts In-Stock

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4,347

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Anansix

USA . 2,671 parts In-Stock

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2,671

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Vyrian

USA . 2,572 parts In-Stock

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2,572

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 741 parts In-Stock

1+ parts

$0.163

100+ parts

-

1k+ parts

$0.147

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741

$0.163

-

$0.147

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MKK Technologies

India . 69 parts In-Stock

1+ parts

$0.306

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69

$0.306

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DigiPath Technology Company

USA . 69 parts In-Stock

1+ parts

$0.306

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69

$0.306

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AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$8.990

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132

$8.990

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A-Z Elektronik GmbH

Germany . 5,826 parts In-Stock

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5,826

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Corphita

USA . 3,968 parts In-Stock

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3,968

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 308 parts In-Stock

1+ parts

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$0.195

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308

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$0.195

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Overview

Elevate your designs with the STIEC45-26ACS from STMicroelectronics, a trusted leader in high-quality electronic components. This reliable transient suppression device ensures robust protection against voltage spikes, enhancing the longevity and performance of your applications. With its compact, surface-mount design and outstanding thermal resilience, it’s perfect for demanding environments. Choose STMicroelectronics for superior quality and innovative solutions that empower your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures protection from environmental factors and enhances the longevity of the device.

Config: SINGLE

Single configuration simplifies integration into designs, making it easy to implement in various applications.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs, leading to more compact device designs.

Package Shape: RECTANGULAR

The rectangular shape ensures easy alignment and placement on the PCB, facilitating automated assembly processes.

No. of Terminals: 2

Two terminals simplify the connection process and enhance compatibility with a wide range of electronic circuits.

Package Style (Meter): SMALL OUTLINE

Small outline package style is ideal for space-constrained applications, making it versatile for modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature makes this product suitable for use in harsh environments, ensuring reliability under extreme conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for use in cold environments, extending the operational range of the device.

Terminal Position: DUAL

Dual terminal position supports flexible board layout options, enhancing design versatility.

Minimum Breakdown Voltage: 28.9 V

Minimum breakdown voltage provides effective suppression of transient voltages, protecting sensitive components in high-voltage circuits.

Maximum Breakdown Voltage: 31.9 V

A maximum breakdown voltage ensures reliable performance during voltage spikes, safeguarding the integrity of electronic systems.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with international standards demonstrates product reliability and effectiveness in transient suppression applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The transient voltage suppressor diode design enables rapid response to voltage transients, offering enhanced protection for circuits.

Technology: AVALANCHE

Avalanche technology ensures efficient and reliable breakdown characteristics, making it an excellent choice for transient voltage protection.

Terminal Form: C BEND

C-bend terminals facilitate easier connection to printed circuit boards, enhancing assembly efficiency.

Maximum Repetitive Peak Reverse Voltage: 26 V

A maximum peak reverse voltage of 26 V ensures protection against repetitive surges, increasing the reliability of sensitive components.

Polarity: BIDIRECTIONAL

Bidirectional capability allows for protection in both directions, making it versatile for various circuit configurations.

Diode Element Material: SILICON

Silicon material provides excellent thermal stability and high performance, ensuring reliable operation across a range of temperatures.

Technical Specifications

Transient Suppression Devices STIEC45-26ACS attributes and parameters. Explore more Transient Suppression Devices devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

31.9 V

Minimum Breakdown Voltage:

28.9 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

DO-214AB

JESD-30 Code:

R-PDSO-C2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

26 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STIEC45-26ACS Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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